Semiconductor Bonding Structure to Contain Overflow and Preserve Insulation
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Solution Overview
Problem
Existing semiconductor devices face challenges in securing insulation reliability and reducing physical size due to bonding member overflow, which can lead to unintended spreading and reduced insulation distance between metal bodies.
Innovation Solution
A semiconductor device design featuring a metal member with a receiving portion to contain the bonding member, preventing overflow and ensuring insulation reliability while allowing for a compact physical size, by having the opposing face of the metal member in contact with the upper face of the front-face metal body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the bonding member is allowed to spread freely during bonding, then the bonding process is simpler, but the insulation distance between metal bodies is reduced and insulation reliability deteriorates
Solution Approach 1:
The patent introduces a receiving portion as an intermediary structure that mediates between the bonding member and the metal bodies. This receiving portion confines the bonding member during bonding, preventing it from spreading to harmful areas while still allowing the bonding process to proceed. The receiving portion acts as a controlled intermediary space that resolves the conflict between bonding simplicity and insulation reliability.
Solution Approach 2:
The receiving portion is designed in advance to prevent the harmful spreading of the bonding member before it can occur. By providing predetermined boundaries and a confined space, the receiving portion applies preliminary anti-action to stop the bonding member from reaching areas that would reduce insulation distance, thus preventing insulation reliability issues before they arise.
2Volume of moving object
If the device size is reduced, then the semiconductor device becomes more compact, but the insulation distance between metal bodies is reduced
Solution Approach 1:
The patent applies local quality by providing insulation structures specifically in critical areas where insulation is needed, rather than uniformly increasing insulation throughout the entire device. The receiving portion and associated insulation structures are localized to where the bonding member requires confinement, allowing the rest of the device to maintain a compact size while still ensuring adequate insulation distance where required.
Solution Approach 2:
The patent segments the device structure into distinct functional zones: the receiving portion that confines the bonding member, the metal bodies that require insulation, and the surrounding compact structure. This segmentation allows each zone to be optimized independently - the receiving portion ensures insulation reliability while the overall device maintains compact dimensions through efficient spatial arrangement.
3Reliability
If the bonding member is confined in a receiving portion, then insulation reliability is improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the receiving portion with the existing substrate or housing structure, rather than adding it as a separate component. By integrating the receiving portion into the existing device architecture, the patent achieves bonding member confinement and improved insulation reliability without significantly increasing overall structural complexity. The receiving portion becomes part of the unified device structure.
Solution Approach 2:
The receiving portion serves multiple functions simultaneously: it confines the bonding member during bonding, provides insulation between metal bodies, and integrates with the overall device structure. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while still achieving improved insulation reliability.
Data Source
AI summary
A semiconductor device includes: a semiconductor element having main electrodes on opposite faces in a plate thickness direction; a substrate having an insulating base member, a front-face metal body disposed on a front face of the insulating base member and electrically connected to one of the main electrodes of the semiconductor element, and a back-face metal body disposed on a back face of the insulating base member; a bonding member; and a metal member connected to the front-face metal body through the bonding member. The metal member has an opposing face opposing an upper face of the front-face metal body and a receiving portion disposed adjacent to the opposing face to provide a receiving space to receive the bonding member therein. The bonding member is received in the receiving space in a state where the opposing face is in contact with the upper face of the front-face metal body.