Semiconductor Apparatus Integrating Chip Bonding and Packaging
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Solution Overview
Problem
Current semiconductor manufacturing processes are complicated and laborious due to the separation of chip bonding and packaging procedures, leading to increased equipment and material costs.
Innovation Solution
A semiconductor manufacturing apparatus that integrates chip bonding and packaging into a single process using a chip supply module, a carrying board supply module, a chip transfer module, and a packaging module, which includes a chip transfer stage, a carrying board motion stage, and packaging material supply units, allowing for simultaneous bonding and packaging of chips on a carrying board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chip bonding and packaging are performed as two separated processes, then each process can be optimized independently, but the manufacturing process becomes complicated and laborious
Solution Approach 1:
The patent combines the chip bonding process and packaging process into a single integrated apparatus. The bonding module bonds chips to a carrying board, and the packaging module subsequently packages the bonded chips without removing them from the carrying board. This merging of two previously separate processes into one continuous operation simplifies the manufacturing process and reduces complexity.
2Ease of manufacture
If two separated processes (bonding and packaging) are used, then each module can be independently optimized, but equipment costs and material costs increase
Solution Approach 1:
The carrying board serves multiple functions: it acts as a substrate for chip bonding, a carrier for transporting bonded chips to the packaging module, and a support structure during packaging. This multi-functional design eliminates the need for separate handling fixtures and reduces material consumption compared to traditional separate processes where chips would be transferred to new substrates.
Solution Approach 2:
By integrating bonding and packaging in one apparatus, the patent eliminates redundant equipment and material handling steps. The carrying board is reused throughout the process rather than being discarded, reducing material costs while the integrated design reduces overall equipment investment.
3Reliability
If chips are bonded and then packaged in separate procedures, then quality control can be performed at each stage, but the manufacturing process becomes more laborious
Solution Approach 1:
The apparatus maintains continuous operation by immediately packaging chips after bonding without interruption or removal from the carrying board. This continuous flow allows quality control at each stage while avoiding the operational complexity of separate handling, transfer, and repositioning operations that would be required in fully separated processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated approach reduces process steps and equipment costs by completing operations typically done by multiple devices in a single device, enabling quicker reuse of the carrying board and minimizing material costs.
Implementation Method 1
a chip transfer module including a chip transfer stage for sucking the plurality of chips
Data Source
AI summary
A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.