Semiconductor Bonding Pad Layout for Lower-Cost Imaging Stacks
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Solution Overview
Problem
The uniform sizing and spacing of bonding pads between semiconductor substrates in existing semiconductor devices lead to increased manufacturing costs and reduced yield due to the need for advanced processes, such as fine patterning and specialized equipment.
Innovation Solution
A semiconductor device design where smaller second and third semiconductors are bonded to a larger first semiconductor, with the third semiconductor's bonding electrodes being larger than the second's, allowing for reduced precision in photomask requirements and process complexity, and increased misalignment margins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform pad sizes and pitches are used for all bonding pads to adapt to fine connections, then connection precision is improved, but manufacturing cost increases and yield deteriorates
Solution Approach 1:
The patent applies local quality by differentiating pad sizes and pitches based on specific connection requirements. The first bonding pads have first sizes and first pitches for fine connections, while the second bonding pads have second sizes and second pitches for standard connections. This allows each region to have the quality appropriate for its function, avoiding the need for advanced processes across the entire substrate.
Solution Approach 2:
The bonding pad structure is segmented into at least two types: first bonding pads with first sizes and first pitches, and second bonding pads with second sizes and second pitches. This segmentation allows different areas to be optimized independently, with fine-pitch pads only where needed and standard pads elsewhere, reducing overall manufacturing complexity.
2Adaptability or versatility
If uniform pad sizes and pitches are used for all bonding pads, then adaptability to fine connections is improved, but device complexity increases
Solution Approach 1:
The patent implements local quality by providing different pad configurations in different regions. The first bonding pads are designed with smaller sizes and tighter pitches specifically where fine connections are required, while the second bonding pads use larger sizes and wider pitches for standard connections, reducing overall device complexity.
Solution Approach 2:
The bonding interface is segmented into multiple types of bonding pads with different specifications. This segmentation allows the device to accommodate both fine-pitch and standard-pitch connections without requiring the entire device to be designed for the most stringent requirements, thereby reducing process complexity.
Data Source
AI summary
A semiconductor device and an imaging device that allow a reduction in manufacturing cost. The semiconductor device includes a first semiconductor in which a plurality of first bonding electrodes is formed, a second semiconductor in which second bonding electrodes each bonded to a corresponding one of the first bonding electrodes are formed, the second semiconductor being smaller in planar size than the first semiconductor, and a third semiconductor in which third bonding electrodes each bonded to a corresponding one of the first bonding electrodes are formed, the third semiconductor being smaller in planar size than the first semiconductor. The second semiconductor and the third semiconductor are bonded to the same surface of the first semiconductor. The third bonding electrodes include electrodes formed to be larger in planar size than the second bonding electrodes. The present disclosure can be applied to, for example, a solid-state imaging device and the like.