Semiconductor Bonding Pad Segmentation for Probe Mark Isolation
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Solution Overview
Problem
Conventional semiconductor devices face issues with defective bonding due to probe marks and uneven load application during electrical inspections, leading to cratering or cracks in electrode pads, which can result in defective bonding wires.
Innovation Solution
A semiconductor device design that includes distinct visually distinguishable bonding pads and test pads formed using the same surface electrode film, with different shapes or sizes, allowing for reliable specification and connection of bonding members without interference from probe marks, thereby preventing defective bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical inspection is performed using probe card contact with electrode pads, then electrical connectivity can be verified, but probe marks and surface deformation occur leading to defective bonding
Solution Approach 1:
The electrode pad structure is segmented into two distinct regions: a bonding pad for wire bonding and a test pad for electrical inspection. This segmentation allows the inspection function to be separated from the bonding function, so that probe marks during inspection do not affect the bonding pad quality. The bonding pad remains intact while the test pad absorbs the inspection damage.
Solution Approach 2:
The testing function is extracted from the bonding pad and relocated to a dedicated test pad. By taking out the inspection activity from the bonding area, the harmful probe marks are confined to the test pad region only, preserving the bonding pad surface for reliable wire bonding.
2Ease of manufacture
If bonding wires are connected to electrode pads with probe marks, then electrical connection is established, but uneven load application causes cratering or cracks
Solution Approach 1:
The pad structure is divided into bonding pad and test pad regions. The bonding pad maintains surface integrity free from probe marks, while the test pad accepts all inspection-related damage. This ensures that when bonding wires are connected to the bonding pad, the surface is uniform and free from defects that would cause uneven load distribution.
3Reliability
If bonding wires ride on probe marks, then bonding may occur, but inclined bonding causes defective bonding
Solution Approach 1:
By segmenting the electrode pad into bonding pad and test pad, the bonding wire placement is guided to the bonding pad region which has a flat, uniform surface. This prevents wires from riding on probe marks, ensuring proper bonding angle and quality while maintaining ease of operation through clear visual distinction between pad types.
Data Source
AI summary
A semiconductor device includes: a semiconductor element; a first bonding pad formed on a surface of the semiconductor element; a test pad formed on the surface of the semiconductor element separately from the first bonding pad and configured to be visually distinguishable from the first bonding pad; and a first bonding member connected to the first bonding pad and used for external electrical connection.