Semiconductor Bonding Pad Segmentation for Signal Redundancy
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Solution Overview
Problem
Conventional stack-type semiconductor packages using through silicon vias (TSVs) are prone to open failures when a single signal is cut, leading to potential failure of the entire product due to the coupling of multiple semiconductor chips through a single link.
Innovation Solution
A bonding structure with a first conductive member, such as a TSV, and a bonding pad comprising multiple sub bonding pads of varying heights, where a bonding member, like solder or an anisotropic conductive film, electrically couples the conductive member to additional conductive members, ensuring signal redundancy by allowing coupling through multiple contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single bonding pad is used to electrically couple conductive members through TSVs, then the bonding structure is simple, but the reliability is low because a single signal cut causes open failure
Solution Approach 1:
The bonding pad is segmented into multiple sub bonding pads (first, second, third sub bonding pads) that are spatially separated. Each sub bonding pad can independently establish electrical connection with corresponding sub conductive members, so that failure of one connection does not affect others. This segmentation transforms a single-point failure mode into a multi-path redundancy system, directly resolving the contradiction between reliability and complexity.
2Reliability
If multiple sub bonding pads are used to provide signal redundancy, then the reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
Different sub bonding pads are designed with different local qualities, specifically different heights. The first sub bonding pad has a first height, the second sub bonding pad has a second height different from the first, and the third sub bonding pad has a third height different from both. This local quality differentiation allows selective electrical connection with sub conductive members at different positions, providing manufacturing flexibility and ease of alignment while maintaining redundancy for high reliability.
3Adaptability or versatility
If all sub bonding pads are at the same height, then the manufacturing process is simpler, but the adaptability to different conductive member positions is reduced
Solution Approach 1:
The bonding pad structure employs asymmetry by designing sub bonding pads with different heights rather than uniform heights. The first sub bonding pad extends to a first height, the second sub bonding pad extends to a second height, and the third sub bonding pad extends to a third height, creating an asymmetric profile. This asymmetry enables the bonding pad to adapt to conductive members positioned at different vertical locations, enhancing coupling adaptability without requiring complex reconfiguration, while the overall structure remains relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces signal failure rates and enhances bonding reliability by enabling signal coupling through remaining sub bonding pads if one or more are opened, ensuring continued functionality.
Implementation Method 1
a bonding member provided on upper surfaces of the sub bonding pads and electrically coupling the first conductive member to a second conductive member
Data Source
AI summary
A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.