Semiconductor Arrangement with Bonding Pad-Supported Wire

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Power semiconductor modules face challenges in minimizing electrical losses and preventing thermal hot spots, with existing designs often resulting in uneven loss distribution and potential premature aging due to thermal disparities among components.

Innovation Solution

The semiconductor arrangement includes a switching device coupled with a diode in parallel, electrically connected via bonding wires with a middle section mechanically attached to a bonding pad, optimizing the layout to achieve symmetric current distribution and reduced thermal hot spots by minimizing bonding wire length and using a ceramic substrate with metallization layers for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional bonding wire arrangements are used to electrically couple switching devices to diodes, then electrical connections are established, but electrical losses increase and thermal hot spots occur due to excessive bonding wire length

Engineering Contradiction:

Improveelectrical lossesVSAvoidbonding wire length

Core Design Contradiction:

Loss of energyVSLength of stationary object

Solution Approach 1:

The patent utilizes the middle section of the bonding wire to create an additional mechanical coupling point to the bonding pad, effectively using the vertical/dimensional space above the substrate to reduce the horizontal path length and optimize electrical connections

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The bonding pad serves as an intermediary element that receives the mechanical coupling from the middle section of the bonding wire, enabling optimized electrical connection between switching devices and diodes while reducing overall wire length and associated losses

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of energy

If components are arranged to minimize electrical losses, then energy efficiency improves, but unequal distribution of electrical losses and thermal hot spots may occur

Engineering Contradiction:

Improveelectrical lossesVSAvoidthermal hot spots

Core Design Contradiction:

Loss of energyVSTemperature

Solution Approach 1:

The patent applies local optimization by creating individual electrical connection paths for each switching device to diode pair through bonding pads, allowing each connection to be independently optimized for minimal losses and balanced thermal distribution across the module

Inventive Principle:

Principle #3Local quality

3Loss of energy

If bonding wire length is reduced to minimize electrical losses, then energy efficiency improves, but mechanical stability and electrical coupling reliability may deteriorate

Engineering Contradiction:

Improveelectrical lossesVSAvoidelectrical coupling reliability

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The bonding wire is segmented into functional sections with the middle section providing mechanical coupling to the bonding pad, creating multiple support points that enhance reliability while allowing the overall wire length to be optimized for minimal electrical losses

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bonding pad acts as an intermediary that provides mechanical support and electrical connection points, enabling the bonding wire to be shorter while maintaining or even improving coupling reliability through the additional support structure

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces electrical losses and thermal hot spots, enhancing the longevity and performance of power semiconductor modules by ensuring even heat distribution and optimized current handling capacity across components.

Implementation Method 1

Each electrically connecting element is arranged to electrically couple one of the at least one switching device to one of the at least one diode

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

using a ceramic substrate with metallization layers for efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11362080B2Semiconductor arrangement

Publication Date: 2022.06.14 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor arrangement includes at least one switching device, electrically coupled between a first terminal and a second terminal, at least one diode, coupled in parallel to the at least one switching device between the first terminal and the second terminal, at least one bonding pad, and at least one electrically connecting element. Each of the at least one electrically connecting element is arranged to electrically couple one of the at least one switching device to one of the at least one diode. Each electrically connecting element includes a first end, a second end, and a middle section, and for at least one of the electrically connecting element, the first end is mechanically coupled to the respective switching device, the second end is mechanically coupled to the respective diode, and the middle section is mechanically coupled to at least one of the at least one bonding pad.