Semiconductor Package Bonding Pattern for Shield Cover Adhesion
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Solution Overview
Problem
Conventional methods for mounting shield covers on semiconductor packages result in reduced bond strength due to a minimized bonding area, leading to decreased adhesion and potential electrical shorts.
Innovation Solution
A semiconductor package design featuring a bonding pattern with a region of expanded width to increase the bonding area, using a metal bonding material that overlaps to retain excess material and prevent electrical shorts, while maintaining cost-effectiveness and self-alignment benefits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the bonding area is minimized to reduce package size, then the package size is reduced, but the bond strength decreases
Solution Approach 1:
The bonding pattern implements local quality by creating regions with different widths: a first region with a first width and a second region with a second width greater than the first width. This allows the bonding structure to have varied local properties, concentrating bonding strength in critical areas while maintaining overall compactness, thus resolving the contradiction between minimized package size and sufficient bond strength.
2Ease of operation
If the copper foil pattern width is regionally reduced to enable cover mounting, then the cover can be mounted on components, but the bonding area further decreases
Solution Approach 1:
The bonding pattern uses local quality by defining specific regions with different widths. The second region has a greater width to provide sufficient bonding area, while other areas can be narrower to accommodate cover mounting requirements. This spatial variation in width allows both cover mounting capability and adequate bonding area to coexist.
3Strength
If the bonding pattern width is expanded to increase bonding area, then bond strength increases, but the package size increases
Solution Approach 1:
Rather than uniformly expanding the bonding pattern width across the entire structure, the invention applies local quality by expanding the width only in specific regions (the second region) where bonding strength is critical. This targeted expansion increases bond strength while minimizing the overall package size increase.
Solution Approach 2:
The bonding pattern is segmented into multiple regions with different widths. The first region has a narrower width while the second region has a greater width. This segmentation allows the structure to optimize bonding strength in specific areas without proportionally increasing the overall package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The expanded bonding pattern enhances bond strength by up to 10% and improves self-alignment effects, reducing the risk of electrical shorts and maintaining cost efficiency through controlled excess material retention.
Implementation Method 1
The cover and the base material are preferably bonded to each other with a conductive bonding material. The bonding material is made of solder metal, an adhesive, and the like.
Implementation Method 2
a region having an expanded pattern width is formed in advance to reliably retain an excess bonding material within the region B. This prevents a contact of the excess bonding material with other metal patterns such as a metal pattern for mounting a capacitor.
Implementation Method 3
when applying the bonding material made of metal to the bonding pattern, the bonding material needs to be applied so that the starting point and the ending point of bonding overlap each other, to increase sealing performance between the cover and the base material.
Data Source
AI summary
A semiconductor package includes a chip base material; a capacitor formed on the base material; and a cover formed over the base material to cover the capacitor, and having a side portion and an upper portion. The base material is provided with a bonding pattern connecting the base material and the cover to cover the capacitor. The bonding pattern includes a region A having a substantially uniform pattern width A, and at least one region B having a pattern width B which is larger than the width pattern width A.