Semiconductor Bonding Alignment Using Dual-Pitch Scale Patterns
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Solution Overview
Problem
Existing semiconductor bonding processes face challenges in achieving precise alignment and efficient yield rates due to misalignment during the bonding of semiconductor devices, leading to increased production time and labor.
Innovation Solution
The use of a flip chip bonding apparatus with an infrared inspection device that employs scale patterns and alignment marks to detect offsets in real-time, allowing for precise alignment and adjustment of semiconductor devices, and includes a method for initial inspection to eliminate defective workpieces and adjust bonding force based on topographical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional bonding processes are used, then the manufacturing process is simpler, but alignment precision deteriorates leading to misalignment
Solution Approach 1:
The patent applies preliminary action by performing initial inspection of workpieces before bonding to detect defects and determine topographical characteristics. Alignment marks are pre-positioned on workpieces to facilitate subsequent alignment operations. This advance preparation enables precise alignment during bonding while maintaining process efficiency.
Solution Approach 2:
The patent implements feedback mechanisms through inspection devices that detect alignment marks and scale patterns in real-time during the bonding process. The system uses this feedback information to dynamically adjust and maintain precise alignment between workpieces, ensuring high manufacturing precision while managing process complexity through automated control.
2Manufacturing precision
If real-time inspection and adjustment are implemented, then alignment precision improves, but production time increases
Solution Approach 1:
The patent maintains continuity of useful action by integrating inspection and alignment adjustment operations directly into the bonding process flow. The inspection device continuously monitors alignment marks during bonding, and adjustments are made without interrupting the overall process. This eliminates separate inspection and repositioning steps, maintaining high precision while minimizing production time loss.
Solution Approach 2:
The patent replaces manual mechanical alignment operations with automated optical inspection and computer-controlled adjustment systems. The inspection device detects alignment marks and provides data to an automated positioning system, eliminating time-consuming manual measurement and adjustment while maintaining high alignment precision throughout the bonding process.
3Reliability
If manual alignment and inspection are used, then equipment complexity is lower, but yield rate deteriorates due to misalignment and defects
Solution Approach 1:
The patent applies preliminary action by conducting initial inspection of workpieces before bonding to identify and eliminate defective items. Alignment marks are pre-positioned on workpieces to facilitate automated alignment. This advance detection and preparation significantly improves yield rate by preventing defective products while the automated equipment manages the increased complexity.
Solution Approach 2:
The patent implements feedback through inspection devices that continuously monitor workpiece quality and alignment during bonding. The system provides real-time data on defects and alignment status, enabling immediate corrective actions to maintain high yield rates. This automated feedback loop improves reliability while the equipment complexity is managed through integrated control systems.
4Productivity
If automated alignment and inspection systems are implemented, then productivity improves, but initial equipment investment increases
Solution Approach 1:
The patent applies universality by designing an integrated system where the bonding apparatus incorporates multiple functions: initial inspection, alignment mark detection, real-time alignment monitoring, and automated positioning. This multi-functional approach improves productivity by consolidating multiple operations into one equipment platform, while the shared infrastructure reduces overall equipment complexity compared to separate dedicated systems.
Solution Approach 2:
The patent implements self-service through automated inspection and alignment systems that perform quality control and positioning without external intervention. The system automatically detects alignment marks, measures positions using scale patterns, and adjusts workpiece locations based on detected offsets. This automation significantly improves manufacturing efficiency while the self-contained nature of the system manages equipment complexity through integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the efficiency of the manufacturing process by reducing production time and enhancing yield rates through precise alignment and defect detection, thereby optimizing the bonding process.
Implementation Method 1
a first plurality of semiconductor devices are inspected through an infrared inspection device and a plurality of topographical characteristics of the first plurality of semiconductor devices are obtained
Data Source
AI summary
A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first alignment pattern having a plurality of first scale patterns arranged in a first direction. The second semiconductor device is mounted over the first semiconductor device and includes a second alignment pattern having a plurality of second scale patterns arranged in a second direction parallel to the first direction, and a scale pitch of the first scale patterns is different from a scale pitch of the second scale patterns.