Semiconductor Bonding Structure for Non-Contact Screen Printing
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Solution Overview
Problem
Current methods for bonding metal lead electrodes to semiconductor elements, such as dispensing supply and screen printing, face challenges like time-consuming processes, poor bonding due to varying material supply, and surface damage or cracking of semiconductor elements.
Innovation Solution
A semiconductor device design featuring an insulating substrate with a mounting area and a non-mounting area of varying height, allowing for the collective supply of bonding material without direct contact with the semiconductor elements, thereby preventing damage and ensuring stable bonding through screen printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If screen printing is used to supply bonding material, then productivity is improved by collective supply, but the metal mask directly contacts the semiconductor element causing surface damage and cracks
Solution Approach 1:
The patent introduces a height dimension by forming a protrusion on the insulating substrate. The protrusion creates a stepped structure where the semiconductor element is mounted on the protrusion surface, which is higher than the surrounding insulating substrate surface. This height difference prevents the metal mask from contacting the semiconductor element during screen printing, while still allowing bonding material to reach the element through the mask opening positioned above the element.
2Object-affected harmful factors
If dispensing supply is used to supply bonding material, then surface damage is avoided, but productivity decreases due to one-by-one processing
Solution Approach 1:
The patent introduces the protrusion structure as an intermediary between the semiconductor element and the metal mask. This intermediary structure enables the use of screen printing (which would otherwise cause damage) by mediating the interaction between the mask and element. The protrusion allows the mask to be positioned above the element without direct contact, while still enabling material transfer through the mask opening.
3Ease of manufacture
If the metal mask contacts the semiconductor element for screen printing, then positioning is simplified, but stress causes cracks and poor characteristics
Solution Approach 1:
The patent segments the substrate surface into different height levels by forming a protrusion. The semiconductor element is mounted on the higher protrusion surface, while the metal mask operates at a higher elevation that spans over the element without contact. This segmentation in height creates distinct functional zones: the protrusion surface for element mounting and the elevated mask position for non-contact material deposition.
Data Source
AI summary
An object of the present disclosure is to suppress damage to or occurrence of cracks on an upper surface of a semiconductor element when a bonding material for connecting a metal lead electrode to a semiconductor element is supplied onto the semiconductor element by screen printing. According to the present disclosure, a semiconductor device (101) includes a plurality of semiconductor elements (1), an insulating substrate (2) having a mounting area (2a1) where the plurality of semiconductor elements (1) are mounted on an upper surface thereof and a non-mounting area (2a2) protruding upward from the mounting area (2a1) and where no plurality of semiconductor elements (1) are mounted, and a metal lead electrode (4) bonded to an upper surface of each of the semiconductor elements (1) with a bonding material (3a), in which a difference in height between the mounting area (2a1) and the non-mounting area (2a2) is greater than or equal to a thickness of each of the semiconductor elements (1).