Semiconductor Bonding Alignment Using Vernier Scale Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor bonding processes face challenges in achieving precise alignment and efficient yield rates due to misalignment during the bonding of semiconductor devices, leading to increased production time and labor.
Innovation Solution
The use of a flip chip bonding apparatus equipped with an infrared inspection device that detects offset values through Vernier scale patterns on semiconductor devices, allowing real-time alignment adjustments and initial defect inspection, thereby improving the bonding process efficiency and yield rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment methods are used during bonding, then the bonding process can be completed, but misalignment occurs leading to reduced manufacturing precision
Solution Approach 1:
The patent applies preliminary action by performing alignment inspection using Vernier scale patterns before the actual bonding process. The infrared inspection device detects offset values in advance, allowing alignment adjustments to be made prior to bonding, thereby preventing misalignment without adding time during the bonding process itself.
Solution Approach 2:
The patent implements feedback by using the infrared inspection device to detect offset values between workpieces through Vernier scale patterns. This detection provides real-time feedback on alignment status, enabling precise adjustments to be made based on actual measured deviations, thus improving alignment precision while maintaining efficient production timing.
2Manufacturing precision
If alignment inspection is performed during bonding, then manufacturing precision improves, but the complexity of the bonding apparatus increases
Solution Approach 1:
The patent applies universality by designing the bonding apparatus to perform multiple functions: the infrared inspection device not only detects alignment through Vernier scale patterns but also identifies defects. This multi-functionality integrates alignment inspection and defect detection into a single system, improving manufacturing precision without proportionally increasing device complexity.
3Measurement precision
If Vernier scale patterns are used for alignment detection, then measurement precision improves, but the difficulty of detecting and measuring increases due to the need for specialized infrared inspection
Solution Approach 1:
The patent applies mechanics substitution by replacing traditional mechanical alignment measurement methods with an infrared optical inspection system. The infrared inspection device detects Vernier scale patterns optically rather than mechanically, achieving high measurement precision while reducing the physical complexity and contact requirements of the inspection process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The infrared inspection device provides precise alignment and defect detection, reducing production time and enhancing the manufacturing yield by ensuring accurate bonding of semiconductor devices.
Implementation Method 1
an infrared inspection device that detects offset values through Vernier scale patterns on semiconductor devices
Data Source
AI summary
A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first alignment pattern having a plurality of first scale patterns arranged in a first direction. The second semiconductor device is mounted over the first semiconductor device and includes a second alignment pattern having a plurality of second scale patterns arranged in a second direction parallel to the first direction, and a scale pitch of the first scale patterns is different from a scale pitch of the second scale patterns.