Semiconductor Hermetic Sealing via Bonding Wire Loop
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices require complex and costly manufacturing processes to achieve hermetic sealing, including forming protrusions and groove structures, which increase production costs and reduce productivity due to additional process steps and potential warpage issues.
Innovation Solution
A semiconductor device is hermetically sealed using a bonding/sealing wire that forms a closed loop between the package case and cap, with crossed wire ends and a concave portion to enhance bonding strength, eliminating the need for preformed solder rings or protrusions, and allowing for simpler manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protrusions and groove structures are formed on the cap and package case to achieve reliable bonding, then bonding reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts the bonding function from complex mechanical structures (protrusions and grooves) and implements it through a simple wire structure. The wire is disposed in a closed loop between the cap and package case, eliminating the need for pre-formed protrusions or grooves while achieving reliable bonding through the wire's inherent flexibility and bonding characteristics
Solution Approach 2:
The invention changes the bonding approach from rigid mechanical interlocking (protrusions/grooves) to a flexible wire-based system that can accommodate warpage. The wire's physical properties (flexibility, low melting point) are leveraged to maintain bonding reliability under varying thermal and mechanical conditions without requiring precise geometric features
2Strength
If protrusions are formed on the cap through additional manufacturing processes, then bonding strength is improved, but production cost and time increase
Solution Approach 1:
The wire is disposed in a closed loop configuration before the bonding process, with wire ends positioned to cross over each other. This preliminary arrangement ensures that when bonding occurs, the crossed wire ends provide inherent bonding strength without requiring additional strengthening features or processes
Solution Approach 2:
The invention uses a simple wire structure that can be easily disposed of or replaced if needed, rather than investing in complex permanent structural features like protrusions. The wire serves its bonding function and can be integrated into the manufacturing flow without requiring expensive tooling or process equipment for feature formation
3Manufacturing precision
If rigid bonding structures are used between cap and package case, then bonding precision is improved, but adaptability to warpage decreases
Solution Approach 1:
The invention replaces rigid bonding structures with a dynamic wire-based system that can adapt to warpage. The wire's flexibility allows it to conform to slight misalignments and warpage in the cap and package case, maintaining bonding integrity while accommodating dimensional variations that would fail with rigid mechanical features
Solution Approach 2:
The wire acts as a flexible element between the cap and package case, similar to how flexible films accommodate dimensional changes. The wire can bend and deform elastically to accommodate warpage while maintaining the closed loop configuration that provides hermetic sealing and bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and complexity while ensuring reliable hermetic sealing of semiconductor elements, even with warpage issues, by using a flexible or low-melting-point bonding wire that can be bonded with minimal pressure, maintaining the integrity of the semiconductor device.
Implementation Method 1
a bonding/sealing wire disposed between and in contact with the bonding portion of the package case and the bonding portion of the cap such that the one or more bonding/sealing wires form a closed loop and thereby hermetically seal the semiconductor element
Data Source
AI summary
A semiconductor device includes: a package case in which a semiconductor element is mounted, the package case having a bonding portion; a cap having a bonding portion bonded to the bonding portion of the package case so as to hermetically seal the semiconductor element; and one or more bonding/sealing wires disposed between and in contact with the bonding portion of the package case and the bonding portion of the cap such that the one or more bonding/sealing wires form a closed loop and hermetically seal the semiconductor element.