Semiconductor Border Protection Sealant for Wafer Singulation
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Solution Overview
Problem
The existing methods of singulating semiconductor wafers, such as wafer sawing, can damage dielectric and metallization layers, leading to delamination and eventual failure of the ICs, as they cut through the semiconductor units, causing damage to the seal ring and propagating delamination.
Innovation Solution
A semiconductor package with a protective sealant coating that fills the grooved edges and surfaces, including sawed, etched, or laser-modified exterior surfaces, and a method involving adhering a carry tape to the wafer, cutting grooves between units, and applying the sealant coating to prevent damage during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer sawing is used to singulate semiconductor units, then productivity is improved, but manufacturing precision deteriorates due to damage to dielectric and metallization layers
Solution Approach 1:
A protective sealant coating is applied to the grooved edges and surfaces of the semiconductor wafer before the singulation process. This preliminary protective action prevents the saw blade from directly contacting and damaging the dielectric and metallization layers during cutting, thereby maintaining manufacturing precision while preserving the productivity benefits of wafer sawing
Solution Approach 2:
The protective sealant coating acts as an intermediary layer between the saw blade and the sensitive semiconductor structures. This intermediary protects the dielectric and metallization layers from direct mechanical contact and damage during the singulation process, resolving the contradiction between efficient cutting and precision preservation
2Productivity
If wafer sawing cuts through semiconductor units, then singulation is achieved, but reliability deteriorates due to delamination propagation
Solution Approach 1:
The protective sealant coating is applied to grooved edges and surfaces before singulation to prevent delamination propagation during the cutting process. This preliminary protection maintains IC integrity while allowing efficient singulation to proceed
Solution Approach 2:
The grooved edges, which would normally be sites of delamination initiation and propagation, are coated with protective sealant that converts these vulnerable areas into protected zones. The harmful effect of grooved edges is transformed into a beneficial protective feature that prevents delamination while maintaining singulation efficiency
Data Source
AI summary
A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which are configured to be connected to corresponding external conductive connectors. The semiconductor package also includes a protective sealant coating filling grooved edges of the active circuitry layer. The protective sealant coating contains an exterior wafer-singulated surface.