Semiconductor Bottom Surface Inspection via Image Synthesis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inspection methods and apparatuses for semiconductor elements are inadequate in inspecting both the top and bottom surfaces, particularly as semiconductor manufacturing processes have advanced to include more complex structures and layers, necessitating a solution to effectively examine the bottom surface.
Innovation Solution
The method involves an inspection apparatus with a supporting unit and camera unit, where the semiconductor element is positioned on multiple plates, and relative movement is generated to capture first and second bottom images, which are then synthesized to obtain a complete bottom image, allowing for thorough inspection of the bottom surface without the limitations of conventional methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional inspection apparatus with a single image capture device positioned above the platform is used, then the top surface of the semiconductor element can be inspected, but the bottom surface cannot be inspected
Solution Approach 1:
The inspection system is segmented into multiple independent image capture devices: one positioned above the platform for top surface inspection, and another positioned below the platform for bottom surface inspection. This segmentation allows each device to independently capture images of its respective surface without interference, resolving the contradiction by enabling comprehensive inspection of both surfaces simultaneously
Solution Approach 2:
The inspection system transitions from a single-dimensional (top-only) inspection approach to a multi-dimensional approach by adding an image capture device in the vertical dimension below the platform. This dimensional expansion enables the system to capture bottom surface images while maintaining top surface inspection capability, thereby eliminating information loss
2Ease of operation
If the bottom surface of the semiconductor element is positioned facing the platform for inspection, then the bottom surface can be accessed, but the top surface patterns cannot be captured
Solution Approach 1:
The inspection system segments the imaging function into two separate pathways: one imaging pathway captures the bottom surface when positioned facing the platform, while another imaging pathway captures the top surface patterns. This segmentation allows both surfaces to be inspected simultaneously without requiring repositioning, resolving the contradiction between accessibility and information completeness
Solution Approach 2:
The system adds an image capture device positioned in the vertical dimension below the platform, enabling bottom surface inspection while the top surface is simultaneously inspected by the original device. This dimensional addition eliminates the need to choose between top or bottom surface inspection, preserving all information
3Measurement precision
If multiple positioning plates are used to support the bottom surface, then the bottom surface can be properly positioned, but the positioning plates may block light from reaching certain areas
Solution Approach 1:
The positioning plates are designed with differentiated local properties: they provide solid support and precise positioning in areas where structural stability is needed, while incorporating transparent or translucent regions in areas where light transmission is required for imaging. This local quality variation resolves the contradiction by maintaining positioning precision without uniformly blocking light across the entire positioning structure
Solution Approach 2:
The positioning plates utilize optical property variations (transparency/translucency) to differentiate between support functions and imaging functions. By making portions of the positioning plates transparent to the inspection light, the system maintains both positioning accuracy and sufficient light intensity for capturing clear images of the bottom surface
Data Source
AI summary
A method for inspecting a semiconductor element includes steps of: a) providing an inspection apparatus including a supporting unit that includes a central seat and a plurality of positioning plates, and a camera unit that includes a first image capture device; b) positioning the semiconductor element onto the positioning plates; c) capturing a first bottom image of the semiconductor element; d) generating relative movement between the semiconductor element and the positioning plates; e) capturing a second bottom image of the semiconductor element; and f) synthesizing the first bottom image and the second bottom image to obtain a complete bottom image of the semiconductor element.