Semiconductor Module Bridge Assembly for High-Density Die Alignment
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Solution Overview
Problem
Existing semiconductor packages face challenges in accurately positioning IC chip terminals and bridges, limiting higher density electrical connections due to difficulties in aligning terminals and restricting the density of terminal connections.
Innovation Solution
A method of manufacturing semiconductor modules involves forming pillar connection sections on a support body, mounting IC chips with die electrodes, sealing, removing the support body, and mounting bridges on the exposed sections to achieve higher density connections by improving positional accuracy and reducing the volume of the sealing body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If two IC chips are electrically connected via a bridge unified with an interposer, then the connection structure is simplified, but it becomes difficult to accurately positionally align each terminal of the two IC chips and a terminal of the bridge
Solution Approach 1:
The invention divides the connection structure into separate components: an interposer with connection sections and a bridge with bridge electrodes. This segmentation allows the interposer to provide precise positioning for IC chip terminals while the bridge provides connection points, resolving the alignment accuracy issue that arises when these functions are unified in a single structure.
Solution Approach 2:
The interposer acts as an intermediary component between the IC chips and the bridge. It includes connection sections that accurately position IC chip terminals and bridge electrodes that connect to the bridge, serving as a mediator that enables precise alignment without requiring the IC chips and bridge to be directly aligned with each other.
2Quantity of substance
If higher density at the terminals electrically connecting the IC chips and the bridge is pursued, then more connections can be made in limited space, but positioning accuracy of terminals becomes more difficult to maintain
Solution Approach 1:
The invention utilizes the vertical dimension by having connection sections extend in the out-of-surface direction. This allows multiple connection points to be arranged in three-dimensional space rather than being constrained to a two-dimensional plane, enabling higher connection density while maintaining positioning accuracy through precise spatial arrangement.
Solution Approach 2:
The interposer is prepared in advance with connection sections that have predetermined positions and orientations. This preliminary preparation of the interposer structure allows for accurate positioning to be established before the actual connection process, making it easier to achieve high density connections with maintained precision.
3Volume of stationary object
If the volume of the sealing body is reduced to enable higher density connections, then more connections can be accommodated, but the protection and sealing of connection sections may be compromised
Solution Approach 1:
The sealing body is designed to seal only the necessary connection sections between the interposer and substrate, rather than enclosing the entire device. This segmented sealing approach reduces the required volume while maintaining effective sealing of the critical connection areas, allowing higher density connections without compromising protection.
Data Source
AI summary
In a method of manufacturing a semiconductor module, a first die including a first die electrode, a second die including a second die electrode, a first connection section connected to the first die electrode, and a second connection section connected to the second die electrode are sealed by a sealing body, and then, a bridge including a first bridge electrode and a second bridge electrode is mounted on a structure sealed by the sealing body. The first die and the second die are electrically connected via the bridge.