Semiconductor Bridge Layer for LED Transfer Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
To increase display resolution, there is a need to transfer more light-emitting diodes (LEDs) or pixels onto a target substrate, but existing technologies face challenges in effectively supporting and separating semiconductor light-emitting devices without damaging them during the pick-up process.
Innovation Solution
A semiconductor structure is designed with a carrier, a bonding structure, a semiconductor stack, and a bridge layer that includes a first portion connected to a supporting element, a second portion extended from the first portion, and a third portion connected to the semiconductor stack, allowing for enhanced adhesion and easy separation of the light-emitting devices by applying an external force that breaks the bridge layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If more LEDs are transferred onto a target substrate to increase display resolution, then the display resolution is improved, but the difficulty of handling and separating the semiconductor light-emitting devices increases
Solution Approach 1:
The bridge layer is divided into multiple portions (first portion connected to supporting element, second portion extended outward, third portion connected to semiconductor stack) with different functions. This segmentation allows the bridge layer to provide both strong adhesion for handling and controlled separation for device release, resolving the contradiction between handling ease and separation difficulty when transferring multiple LEDs
Solution Approach 2:
The bridge layer acts as an intermediary component between the supporting element and the semiconductor stack. It provides a controlled interface that enables easy handling during transfer while allowing clean separation when needed, thus facilitating the transfer of multiple LEDs without damage
2Stability of the object's composition
If a bridge layer is designed to connect supporting element and semiconductor stack, then the adhesion and handling stability are improved, but the complexity of the semiconductor structure increases
Solution Approach 1:
The bridge layer is segmented into multiple portions with distinct functions: first portion for connection to supporting element, second portion for external extension enabling handling, and third portion for connection to semiconductor stack. This segmentation provides handling stability while maintaining relatively simple overall structure
Solution Approach 2:
The bridge layer serves multiple functions simultaneously: providing mechanical support, enabling handling through external extension, ensuring stable connection to both supporting element and semiconductor stack, and allowing controlled separation. This multi-functionality reduces the need for additional components, keeping the structure relatively simple
3Ease of operation
If the bridge layer is extended outward to facilitate handling, then the ease of pick-up operation is improved, but the risk of damaging the semiconductor device during separation increases
Solution Approach 1:
The bridge layer is segmented such that the second portion extends outward for handling while the first and third portions maintain secure connections to the supporting element and semiconductor stack respectively. This segmentation allows external manipulation without transmitting excessive stress to the semiconductor device, preserving device integrity during separation
Solution Approach 2:
The bridge layer acts as a stress-absorbing intermediary between the handling force applied to the second portion and the semiconductor stack. The extended second portion allows pick-up operation while the bridge layer's structural design prevents damage transmission to the semiconductor device during separation
Data Source
AI summary
A semiconductor structure includes a carrier, a bonding structure, a semiconductor stack, a supporting element and a bridge layer. The bonding structure is on the carrier and has an upper surface. The semiconductor stack is on the bonding structure. The supporting element is on the bonding structure and has a side wall. The bridge layer has a first portion directly connected to the supporting element, a second portion connected to the first portion and a third portion connected to the second portion. The second portion and the third portion of the bridge layer are suspended above the upper surface of the bonding structure. The first portion of the bridge layer directly contacts the side wall of the supporting element.