Semiconductor Bubble Removal via Ultrasonic Cavitation
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Solution Overview
Problem
Existing semiconductor inspection methods are inefficient in removing fine bubbles, which can obstruct the inspection of semiconductor products and determine defectiveness, and require extensive time for removal.
Innovation Solution
An apparatus and method utilizing a water tank with signal generators emitting ultrasonic signals at different inclinations to create a cavitation phenomenon, effectively removing foreign matter, including fine bubbles, from semiconductor products within a short time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bubbles are removed using a pipette, then bubbles can be removed from the semiconductor product, but it takes a lot of time and there is a limit to removing fine bubbles
Solution Approach 1:
The patent replaces the manual mechanical pipette method with an ultrasonic wave-based removal system. The signal generator emits ultrasonic waves that create cavitation effects in the liquid, automatically removing bubbles and foreign matter from the semiconductor product without manual intervention, thereby resolving the contradiction between removal completeness and time consumption
Solution Approach 2:
The patent utilizes ultrasonic vibration through the signal generator to create high-frequency oscillations in the liquid medium. This vibration generates cavitation bubbles that collapse and create micro-jets, effectively dislodging and removing fine bubbles and foreign matter from the semiconductor product surface, achieving both complete removal and time efficiency
2Measurement precision
If bubbles are attached onto the semiconductor product, then the inspection object can be inspected, but the inside of the portion to which bubbles are attached may not be inspected properly
Solution Approach 1:
The patent applies ultrasonic wave treatment before the inspection process to pre-remove bubbles and foreign matter from the semiconductor product. This preliminary action ensures that the inspection is performed on a clean surface without bubble interference, thereby maintaining high measurement precision
Solution Approach 2:
The patent converts the harmful effect of bubble attachment into a beneficial cleaning mechanism. By using ultrasonic cavitation, the same bubble formation mechanism is harnessed to break down and remove unwanted bubbles and foreign matter, transforming the interference into a useful pre-cleaning step that improves inspection accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces bubble removal time from 20 minutes to 10 seconds, enhancing inspection efficiency and consistency, and improving bubble removal performance in semiconductor fabrication.
Implementation Method 1
utilizing a water tank with signal generators emitting ultrasonic signals at different inclinations to create a cavitation phenomenon, effectively removing foreign matter, including fine bubbles
Implementation Method 2
signal generators on a bottom surface of the housing and each configured to output a frequency signal
Data Source
AI summary
An apparatus and a method for inspecting a semiconductor includes a water tank which includes a housing, an interior of which is filled with a liquid, and a support block which provides a settling surface for an inspection object inside the housing. A plurality of signal generators are installed on a bottom surface of the housing, and output a frequency signal in a direction in which the inspection object is located. A power supply operates the signal generators. A probe is placed above the inspection object, and a receiver which operates with the probe and is attached to a bottom surface of the support block. Foreign matter remaining on the inspection object are removed, using a plurality of frequency signals which are output by the plurality of signal generating units.