Semiconductor Package Buffer Block for Flat Fine-Pitch RDL
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes due to inadequate surface stability for fine-pitched redistribution layer (RDL) formation, often resulting in uneven or wavy surfaces beneath the RDL.
Innovation Solution
The introduction of a buffer block with a different dielectric material, disposed between electronic components, which provides a substantially flat surface for the redistribution structure, improving surface morphology and stability for RDL formation. This buffer block can be made of materials like SiO2, SiN, or Al2O3 and is designed to be a high flattening or stress-relieving dielectric block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor packages are used without a buffer block, then the package structure is simpler and manufacturing is easier, but the surface is uneven or wavy resulting in poor RDL formation quality
Solution Approach 1:
A buffer block is introduced as an intermediary element between the semiconductor die and the redistribution layer (RDL). This buffer block serves as a mediator that provides a flat, stable surface for RDL formation, eliminating the need for complex surface preparation processes while ensuring high manufacturing precision for fine-pitched RDL patterns.
Solution Approach 2:
The buffer block is formed in advance before RDL deposition, creating a pre-prepared flat surface that eliminates the need for subsequent surface planarization steps. This preliminary action ensures that the RDL can be formed with high precision without requiring additional complex processing steps.
2Reliability
If a buffer block is added to provide surface stability, then RDL formation quality improves, but the device complexity and manufacturing process increase
Solution Approach 1:
The buffer block performs multiple functions simultaneously: it provides mechanical support, creates a flat surface for RDL formation, acts as a stress relief layer, and serves as an electrical isolation barrier. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving high surface stability and reliability.
Solution Approach 2:
The buffer block is strategically positioned only in the specific region where surface stability is critical for RDL formation, rather than throughout the entire package. This localized approach provides the necessary reliability improvement while minimizing the increase in overall device complexity.
3Productivity
If conventional packaging methods are used, then manufacturing cost is lower and process is simpler, but package size becomes too large and performance is reduced
Solution Approach 1:
The introduction of the buffer block enables significant reduction in RDL pitch and improvement in surface flatness, which allows for higher density interconnect structures. This parameter change in surface quality enables more efficient space utilization, reducing overall package size while maintaining manufacturability through standardized buffer block integration.
Data Source
AI summary
In one example, an electronic device can include a first electronic component and a second electronic component adjacent the first electronic component. A buffer block can be disposed between the first electronic component and the second electronic component. An encapsulant can be disposed on the first electronic component, the second electronic component, and the buffer block. A side of the buffer block can be substantially flat and coplanar with a side of the encapsulant. A redistribution structure can be disposed over the side of the encapsulant and the side of the buffer block. Other examples and related methods are also disclosed herein.