Semiconductor Heat Dissipation Plate Bulge Design
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Solution Overview
Problem
Existing power semiconductor devices face challenges in reliable heat dissipation and product attachment due to the degradation of flexible heat dissipation plates and failure to account for warpage in heat dissipation plates, leading to inefficient heat transfer and unstable attachment.
Innovation Solution
A semiconductor device design featuring a heat sink, a flat heat dissipation plate with an arc-shaped bulge, and a case with projections and attachment holes, where the angle formed by imaginary lines connecting attachment holes and projections is controlled to ensure stable attachment and prevent upward detachment, enhancing heat dissipation and attachment reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a flexible heat dissipation plate is used to accelerate heat dissipation, then heat dissipation efficiency is improved, but the product deteriorates with time
Solution Approach 1:
The patent changes the physical state of the heat dissipation plate from flexible to rigid, and introduces a controlled bulge deformation (parameter) to achieve both good thermal contact and long-term reliability. The bulge amount is specifically controlled within 0.1mm to 1.0mm to prevent warpage while maintaining heat dissipation performance.
2Reliability
If a small projection is added to eliminate flexible plate need, then product durability is improved, but attachment quality deteriorates due to warpage
Solution Approach 1:
The patent introduces a bulge (curved surface) on the heat dissipation plate instead of keeping it completely flat. This curvature compensates for warpage effects and improves attachment precision. The bulge creates a controlled deformation that accounts for thermal expansion and mounting variations.
Solution Approach 2:
The patent applies different properties to different parts of the heat dissipation plate: the center has a bulge for compensation, while the peripheral attachment regions maintain rigidity for stable attachment. This local differentiation allows simultaneous achievement of durability and precision.
3Ease of manufacture
If the attachment hole position is not adjusted for warpage, then manufacturing is simpler, but attachment stability deteriorates
Solution Approach 1:
The patent positions the attachment holes asymmetrically relative to the bulge, with specific angular relationships (30° to 60° from the bulge center line). This asymmetric arrangement compensates for warpage effects while maintaining reasonable manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled angle and projections stabilize the attachment of the semiconductor device to the heat sink, improving heat dissipation efficiency and preventing detachment, thus enhancing the overall attachment and thermal conductivity of the semiconductor device.
Implementation Method 1
efficiently dissipating heat generated in the power chip to an external structure, such as a heat sink is highly important. The use of a thermally conductive material enables efficient heat dissipation
Implementation Method 2
a bulge bulging out from the lower end of the body in the form of an arc in cross-sectional view
Data Source
AI summary
Provided is a technique for improving product attachment. In a semiconductor device, the following expression is satisfied by an angle A formed by an imaginary line connecting two attachment holes together and an imaginary line connecting together a lowest point of one of two projections positioned in a surrounding portion of one of the two attachment holes and a contact point between a bulge and a heat sink, with a screw fastened to the heat sink through the one attachment hole, where M represents a vertical direction between the lower end of a body and the lower end of a case, where W represents a bulge amount of the bulge, where T represents a height of the projection, where L represents a horizontal distance from the outer peripheral end of the case to the outer peripheral end of the heat dissipation plate: 0<A<arctan((M+W−T)/L).