Semiconductor Bump Alignment via Electromagnetic Field
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Solution Overview
Problem
The miniature scale of modern integrated circuits poses challenges in maintaining the position of bumps during packaging, leading to issues like bump bridging and shifting, which affect yield in Flip-chip and Wafer level chip scale packaging processes.
Innovation Solution
A conductive trace, typically c-shaped, is integrated within the semiconductor device to generate an electromagnetic field that aligns and secures bumps with under bump metallization, ensuring precise positioning and maintaining contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the size of integrated circuits is reduced to miniature scale, then the density and integration level are improved, but the position stability of bumps during packaging deteriorates
Solution Approach 1:
The patent applies preliminary action by forming a positioning structure (such as a positioning protrusion and positioning groove) before the bump placement process. This pre-formed structure guides and constrains the bump during subsequent packaging operations, ensuring accurate positioning while maintaining stability. The positioning structure is created in advance on the substrate, so when bumps are placed, they are automatically guided into correct positions, preventing both bridging and shifting issues.
2Productivity
If conventional packaging processes are used without additional positioning structures, then the manufacturing complexity is reduced, but bump bridging and shifting occur affecting yield
Solution Approach 1:
The patent merges the positioning function with the existing substrate structure by integrating the positioning protrusion into the substrate's interconnect layers or support structure. Rather than adding a completely separate positioning system, the positioning features are combined with the existing packaging substrate architecture, thereby improving bump positioning accuracy without significantly increasing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electromagnetic field effectively adjusts the position of bumps, preventing bridging and shifting, thereby enhancing the yield and reliability of semiconductor packaging by ensuring accurate alignment and secure bonding.
Implementation Method 1
A conductive trace, typically c-shaped, is integrated within the semiconductor device to generate an electromagnetic field that aligns and secures bumps with under bump metallization
Data Source
AI summary
A semiconductor device having a semiconductor substrate is provided. The semiconductor substrate includes an integrated circuit, which includes multi-layer structured metallization and inter-metal dielectric. The integrated circuit is below a passivation, which is over a metal structure. The metal structure includes a metal pad and an under bumper metallurgy, which is over and aligned with the metal pad. The metal pad is electrically connected to the integrated circuit, and the under bumper metallurgy is configured to electrically connect to a conductive component of another semiconductor device. The integrated circuit further includes a conductive trace, which is below and aligned with the metal structure. The conductive trace is connected to a power source such that an electromagnetic field is generated at the conductive trace when an electric current from the power source passes through the conductive trace.