Semiconductor Interconnection Flexibility via Segmented Bump Electrodes
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Solution Overview
Problem
Conventional semiconductor devices have fixed contact pad positions, limiting the flexibility of interconnections between the chip and other interfaces, which restricts the flexibility and reliability of signal transmission.
Innovation Solution
A semiconductor device design that includes a chip with a first bump electrode on a contact pad, a conductive wire on the chip's active surface electrically connected to the first bump electrode, and a second bump electrode formed on the conductive wire but not over any contact pad, allowing for increased interconnection flexibility and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If contact pad positions are fixed on the chip, then the chip structure is simple and manufacturing is easier, but the flexibility of interconnection between the chip and other interfaces is reduced
Solution Approach 1:
The interconnection structure is segmented into multiple components: contact pads on the chip, conductive wires extending from contact pads, and bump electrodes formed on the conductive wires. This segmentation allows the bump electrodes to be positioned independently from the contact pads, enabling flexible interconnection routing while keeping the chip structure relatively simple.
Solution Approach 2:
The invention extends the interconnection structure into a third dimension by forming bump electrodes on conductive wires that protrude from the chip surface. This vertical dimensionality change allows signal routing flexibility without requiring complex lateral repositioning of contact pads on the chip plane.
2Adaptability or versatility
If bump electrodes are formed directly on contact pads in fixed positions, then the manufacturing process is simpler, but the routing flexibility and reliability of signal transmission are limited
Solution Approach 1:
The manufacturing process is segmented into distinct steps: forming contact pads on the chip, extending conductive wires from the contact pads, and then forming bump electrodes on the conductive wires. This segmentation of the manufacturing process enables routing flexibility while maintaining manufacturing feasibility through standardized processing steps.
Solution Approach 2:
The conductive wires are preliminarily formed and extended from the contact pads before the bump electrodes are formed. This preliminary action establishes the flexible routing path in advance, allowing subsequent bump electrode formation at optimized positions for reliable signal transmission.
3Adaptability or versatility
If wires or contact pads are used to correspond to fixed bump positions, then the chip can be connected to other interfaces, but the flexibility of interconnection is reduced
Solution Approach 1:
By forming bump electrodes on conductive wires that extend vertically from the chip surface, the invention creates a three-dimensional interconnection structure. This dimensional change allows the bump electrodes to be positioned at optimized locations for reliable signal transmission while maintaining flexibility in interconnection routing.
Solution Approach 2:
The conductive wire acts as an intermediary element between the contact pad on the chip and the bump electrode. This intermediary structure decouples the positioning constraints of the contact pad from the bump electrode, enabling both routing flexibility and signal transmission reliability.
Data Source
AI summary
A semiconductor device has a chip, a first bump electrode, a conductive wire and a second bump electrode. The chip has at least one contact pad, and the first bump electrode is formed on the contact pad. The conductive wire is disposed on an active surface of the chip and electrically connected to the first bump electrode. The second bump electrode is formed on the conductive wire, and the second bump electrode is not disposed over any contact pad of the chip. In addition, a method for packaging a chip and an IC package are also disclosed.