Semiconductor Device Bump Mounting Heat Dissipation

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Solution Overview

Problem

Next-generation power devices used in automotive electronics face challenges with high-temperature operation, electric noise due to inductance in wire bonding, and the need for enhanced heat dissipation, particularly in compact engine room environments.

Innovation Solution

A semiconductor device design featuring a lead frame, circuit board, power device with a switching element, and a heat releasing member connected via a bump, with a sealing resin and a heat releasing member extending in multiple directions to efficiently dissipate heat and reduce electric noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding method is used for mounting power device, then electrical connection is achieved, but inductance component causes electric noise

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidelectric noise

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and removes the wire bonding structure from the power device mounting, replacing it with a direct bonding method. This eliminates the inductance component inherent in wire bonding that causes electric noise, while maintaining reliable electrical connection through direct metal-to-metal bonding between the power device electrodes and the substrate.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical wire bonding system with a direct bonding system. Instead of using wires to connect electrodes, the power device is directly bonded to the substrate through bump structures, eliminating the mechanical wire component that generates inductance and electric noise during high-frequency switching operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Power

If power device operates at high temperature, then switching performance is improved, but heat accumulation deforms resin material

Engineering Contradiction:

Improveswitching performanceVSAvoidheat accumulation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent introduces a heat releasing member as an intermediary between the power device and the resin sealing material. This heat releasing member conducts heat away from the power device through thermal conduction, preventing heat accumulation that would otherwise deform the resin material, while allowing the power device to operate at high temperatures for improved switching performance.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the thermal parameter of the mounting structure by incorporating a heat releasing member with high thermal conductivity. This modifies the heat dissipation capability of the system, enabling the power device to operate at elevated temperatures without causing resin deformation, thus maintaining both switching performance and structural integrity.

Inventive Principle:

Principle #35Parameter changes

3Volume of moving object

If power device size is reduced for limited space, then mounting space is optimized, but heat dissipation capability is reduced

Engineering Contradiction:

Improvepower device sizeVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent addresses the heat dissipation challenge in compact devices by extending the heat releasing member in multiple directions (upward, downward, and laterally). This multi-dimensional heat dissipation structure allows efficient heat removal from the small power device without increasing the overall device volume, maintaining both compact size and heat dissipation capability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If conventional mounting method is used, then manufacturing process is simple, but heat releasing characteristic is insufficient

Engineering Contradiction:

Improvemounting process simplicityVSAvoidheat releasing characteristic

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent merges the mounting function with the heat dissipation function by integrating the heat releasing member into the mounting structure. The bump structures serve both as electrical connection elements and as thermal conduction paths, eliminating the need for separate heat dissipation components and maintaining manufacturing simplicity while improving heat releasing characteristics.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design provides a high-output power device with improved heat releasing characteristics, reducing the risk of electric noise and maintaining performance in high-temperature conditions while minimizing size and noise interference.

Implementation Method 1

a heat releasing member connected to the power device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10236231B2Semiconductor device

Publication Date: 2019.03.19 AMKOR TECH JAPAN INC

AI summary

A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.