Semiconductor Bump Stability via Insulation Structure Adhesion
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Solution Overview
Problem
Dummy bumps in semiconductor flip packaging often fall off during the process, leading to poor contact between the wafer and substrate, affecting the reliability of the packaged device.
Innovation Solution
A semiconductor structure is designed with a base, an insulating layer, a first metal bump in contact with the pad, a second metal bump on the insulating layer, and an insulation structure in contact with the sidewall of the second metal bump, where the adhesion between the insulation structure and the insulating layer is greater than the adhesion between the second metal bump and the insulating layer, securing the second metal bump and reducing the risk of fall-off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy bumps are formed on the insulating layer before flip packaging, then good contact between the wafer and substrate is achieved, but the dummy bumps easily fall off during the packaging process
Solution Approach 1:
The patent applies preliminary action by forming the insulation structure around the dummy bumps before the flip packaging process. This pre-formed protective structure prevents the bumps from falling off during subsequent packaging operations, addressing the stability issue while maintaining contact reliability.
Solution Approach 2:
The insulation structure acts as an intermediary element between the dummy bumps and the external environment. It provides mechanical support and protection to the bumps, preventing them from detaching during packaging while allowing the bumps to maintain their electrical contact function.
2Stability of the object's composition
If the adhesion between the second metal bump and the insulating layer is increased, then the bump stability is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the stabilization function from the bump itself by introducing a separate insulation structure. Instead of modifying the bump or insulating layer materials to increase adhesion, the solution divides the system into distinct functional components: the bump for electrical contact and the insulation structure for mechanical support.
Solution Approach 2:
The insulation structure serves as an intermediary that provides mechanical support without requiring strong adhesion between the metal bump and insulating layer. This intermediary approach simplifies manufacturing by avoiding complex adhesion enhancement processes while still achieving bump stability.
3Stability of the object's composition
If the insulation structure is added to secure the second metal bump, then the bump stability is improved, but the device complexity increases
Solution Approach 1:
The insulation structure performs multiple functions simultaneously: it provides mechanical support to prevent bump detachment, maintains the insulating properties between adjacent bumps, and offers a platform for subsequent packaging processes. This multi-functionality justifies the added structural element by consolidating multiple requirements into a single component.
Solution Approach 2:
The insulation structure is applied locally around the dummy bumps rather than uniformly across the entire wafer surface. This localized approach minimizes the overall structural complexity while providing targeted support where it is most needed - at the bump locations prone to detachment during packaging.
Data Source
AI summary
Embodiments of the present disclosure relate to a semiconductor structure and a manufacturing method thereof. The method includes: providing a base, wherein a pad is provided on the base; forming an insulating layer on the base, wherein the insulating layer is provided with an opening that exposes the pad; forming a first metal bump in the opening, wherein the first metal bump is in contact with the pad; forming a second metal bump on an upper surface of the insulating layer; forming an insulation structure at least on the upper surface of the insulating layer, wherein the insulation structure is in contact with a sidewall of the second metal bump. An adhesion between the insulation structure and the insulating layer is greater than an adhesion between the second metal bump and the insulating layer.