Semiconductor Bump Structures with Different Shapes

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Solution Overview

Problem

Semiconductor packages face challenges in reducing the possibility of short circuiting between adjacent bump structures during fabrication, particularly due to the increasing density and reduced pitch of connection terminals, which affects the reliability and efficiency of semiconductor chips in emerging electronic devices.

Innovation Solution

The implementation of bump structures with different shapes, including first and second bump structures, which provide distinct bonding interfaces and are vertically offset to minimize the risk of short circuiting, while also serving as active and dummy structures for electrical connection and heat dissipation respectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If bump structures with uniform shapes are used to simplify manufacturing, then manufacturing precision is improved, but reliability deteriorates due to increased short circuiting risk during over-pressing conditions

Engineering Contradiction:

Improvebump structure uniformityVSAvoidshort circuit resistance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies asymmetry by designing bump structures with different shapes (e.g., spherical vs. cylindrical) at different locations. This asymmetric design creates vertical offsets between adjacent bumps of different types, preventing them from aligning at the same height during stacking. The asymmetry in shape and positioning effectively reduces short circuiting risk during over-pressing conditions while maintaining manufacturing feasibility through controlled formation processes.

Inventive Principle:

Principle #4Asymmetry

2Productivity

If the pitch between connection terminals is reduced to increase density, then productivity is improved, but reliability deteriorates due to increased short circuiting risk

Engineering Contradiction:

Improvechip densityVSAvoidshort circuit resistance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The asymmetric bump design creates vertical separation between adjacent connection terminals even when their horizontal pitch is reduced. By having bumps of different shapes (spherical, cylindrical, conical) at different heights, the structure prevents lateral spreading and short circuiting between closely spaced terminals, enabling higher density packaging while maintaining reliability.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent transitions from a two-dimensional planar arrangement to a three-dimensional vertical arrangement by offsetting bumps in the height dimension. This dimensional change allows terminals to be closely spaced in the horizontal plane while maintaining electrical isolation through vertical separation, effectively increasing chip density without compromising reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Strength

If larger bump structures are used to improve electrical connection, then strength is improved, but device size increases

Engineering Contradiction:

Improveelectrical connection strengthVSAvoidpackage size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The patent applies local quality by assigning different bump shapes and sizes to different locations and functions within the package. Critical electrical connections use larger or more robust bump shapes (cylindrical, conical) for strength, while non-critical connections use smaller spherical bumps. This localized optimization provides adequate connection strength where needed while minimizing overall package size.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite structures by combining different bump geometries (spherical, cylindrical, conical) within the same package. Each bump type serves specific functional requirements, creating a composite connection system that optimizes both electrical strength and space utilization. The varied geometries allow efficient space packing while maintaining necessary connection strengths.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the electrical characteristics and reliability of semiconductor packages by reducing the likelihood of short circuiting and improving heat dissipation, thereby ensuring higher product reliability and production yields in densely packed semiconductor packages.

Implementation Method 1

Bump structures may connect the first semiconductor chip and the second semiconductor chip, wherein the bump structures include first bump structures having a first shape and second bump structures having a second shape different from the first shape

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

second bump structures having a second shape different from the first shape and providing heat transfer from at least one of the logic chip and the memory chip

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20230035032A1Semiconductor package including bump structures with different shapes

Publication Date: 2023.02.02 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes; a first semiconductor chip and a second semiconductor chip connected by bump structures, wherein the bump structures include first bump structures having a first shape and second bump structures having a second shape different from the first shape, and each of the bump structures includes a first pillar layer associated with the first semiconductor chip and a second pillar layer associated with the second semiconductor chip.