Semiconductor Package Bump Pads With Trench Portions
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Solution Overview
Problem
The increasing demand for compact and multifunctional semiconductor devices with fine-pitch connection structures poses challenges in ensuring reliable electrical connections, as smaller solder balls are prone to poor bonding and damage from external stress.
Innovation Solution
The semiconductor package design includes a semiconductor chip with a chip pad, an insulating layer, a redistribution pattern, and an external bump pad with trench portions, where the external connector contacts the insulating layer through these trenches, increasing the contact area and enhancing bonding during the solder-ball attach process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of solder ball is decreased to achieve fine-pitch connection, then the connection density is improved, but the bonding reliability deteriorates and the solder ball becomes easily damaged by external stress
Solution Approach 1:
The patent introduces a trench structure that extends vertically into the bump pad, adding a depth dimension to the connection interface. This allows the external connector to contact the bump pad at multiple levels (surface and trench bottom), effectively increasing the contact area without increasing the planar footprint, thereby maintaining fine-pitch density while improving bonding reliability
Solution Approach 2:
The bump pad is segmented by the trench structure, creating distinct contact zones: the trench portion and the remaining bump pad surface. The external connector is positioned to contact both the trench portion and the insulating layer, creating multiple contact points that distribute stress and improve overall connection reliability
2Reliability
If the contact area between external connector and bump pad is increased to improve bonding reliability, then the joint strength is improved, but the device complexity increases
Solution Approach 1:
Instead of increasing the planar contact area which would require larger pitch, the patent utilizes the vertical dimension by etching trenches into the bump pad. This allows the external connector to access deeper regions of the bump pad through the trench, increasing effective contact area while maintaining the same planar footprint and avoiding increased device complexity
Data Source
AI summary
A semiconductor package includes a semiconductor chip including a chip pad and an external bump pad electrically connected to the chip pad of the semiconductor chip. The external bump pad may include a trench portion extending from a perimeter surface of the external bump pad toward a center of the external bump pad. The semiconductor package includes an external connector on the external bump pad, with the external connector including a portion that is in the trench portion of the external bump pad.