Semiconductor Device With Buried Through-Hole Electrodes
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Solution Overview
Problem
Existing display devices face challenges with the thickness and size of printed circuit boards due to the mounting of electronic elements, which limits the secure distance between components and affects reliability.
Innovation Solution
A semiconductor device with a substrate having opposite surfaces, through holes, conductive pads, and bumps of different sizes, along with passive elements like capacitors, is used to connect electronic elements directly to the semiconductor device, minimizing the printed circuit board's spatial requirements and allowing for efficient mounting of passive and active elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic elements are mounted on a printed circuit board, then the printed circuit board can be reused, but the thickness and size of the printed circuit board increase
Solution Approach 1:
The patent extracts electronic elements (such as passive elements like capacitors and inductors) from the printed circuit board and mounts them directly on the semiconductor device. This extraction reduces the spatial requirements of the printed circuit board while maintaining the ability to reuse it, as the PCB can be reused without the burden of mounted components increasing its volume.
Solution Approach 2:
The patent transitions the mounting location of electronic elements from the two-dimensional plane of the printed circuit board to the three-dimensional structure of the semiconductor device. By mounting components on the semiconductor device's substrate and utilizing vertical space through bumps and connection electrodes, the solution relocates components to another dimension, freeing up PCB space while maintaining reusability.
2Ease of manufacture
If electronic elements are mounted on a printed circuit board, then the printed circuit board can be reused, but it becomes difficult to secure distance between adjacent electronic elements
Solution Approach 1:
By extracting electronic elements from the printed circuit board and mounting them on the semiconductor device, the patent eliminates the spatial constraint problem on the PCB. The semiconductor device's structure provides adequate spacing between mounted components, ensuring proper distance between adjacent electronic elements while the PCB remains reusable.
Solution Approach 2:
The patent applies different mounting strategies to different locations: small bumps are used for precise positioning where small components are mounted, while larger bumps provide sufficient spacing for larger components. This localized approach to bump sizing ensures adequate distance between adjacent electronic elements while maintaining efficient space utilization on the semiconductor device.
3Ease of manufacture
If electronic elements are mounted on a printed circuit board, then the printed circuit board can be reused, but reliability decreases due to insufficient distance between components
Solution Approach 1:
The patent extracts electronic elements from the printed circuit board environment and relocates them to the semiconductor device, which provides a more reliable mounting platform. This extraction eliminates the reliability issues associated with insufficient spacing on the PCB, as the semiconductor device's structured substrate and connection system ensure proper spacing and electrical connections.
Solution Approach 2:
The patent uses different sized bumps tailored to specific component requirements: smaller bumps for compact components and larger bumps for components requiring more space and thermal management. This localized quality approach ensures each component is mounted with appropriate spacing and connection quality, thereby improving overall system reliability while maintaining PCB reusability.
Data Source
AI summary
A semiconductor device includes: a semiconductor chip including a substrate having a first surface and a second surface, which are opposite to each other; a through hole penetrating the substrate; a first conductive pad on the first surface of the substrate; a first bump formed over and electrically connected to the first conductive pad; a second conductive pad on the second surface of the substrate; a second bump formed over and electrically connected to the second conductive pad; and a connection electrode buried in the through hole, the connection electrode electrically connecting the first bump and the second bump.