Semiconductor Assembly Bus Bar Clamping
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Solution Overview
Problem
Existing press pack modules for HVDC converters require a large number of heavy and expensive mechanical parts to achieve proper electrical and thermal contact, leading to complex and costly assemblies.
Innovation Solution
A semiconductor assembly with a simplified mechanical design featuring a single bus bar, insulation elements, and a compact clamping assembly that reduces the number of mechanical parts and enhances even current distribution, allowing for improved electrical and thermal connections using a flat semiconductor module and circular cooler configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large number of mechanical parts are used to create press pack stacks, then proper electrical and thermal contact is ensured, but the assembly becomes heavy and complex
Solution Approach 1:
The patent combines multiple mechanical components (yokes, rods, springs) into a single integrated press pack module. The module integrates the semiconductor device, insulator, and clamping structure into one unified component that can be directly mounted between cooler plates, eliminating the need for separate mechanical parts while maintaining reliable electrical and thermal contact.
Solution Approach 2:
The press pack module is designed as a universal component that performs multiple functions simultaneously: electrical connection, thermal management, mechanical clamping, and insulation. This multi-functional design reduces the number of separate parts needed while ensuring reliable operation.
2Stability of the object's composition
If multiple yokes and rods are provided to enclose and support the stack, then structural stability is achieved, but the weight increases
Solution Approach 1:
The patent merges the functions of multiple yokes and rods into a single integrated press pack module structure. The module's internal design provides structural stability without requiring external enclosing yokes and support rods, significantly reducing the overall weight of the mechanical assembly.
3Device complexity
If a simplified mechanical design with fewer parts is used, then weight and cost are reduced, but electrical properties such as current distribution may worsen
Solution Approach 1:
The patent employs local quality optimization by designing the single bus bar with specific geometric features and the insulator with optimized dimensions and material properties. These localized design features ensure uniform current distribution across the module while maintaining the simplified single-part mechanical structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves lower inductance, more even current distribution, and reduced complexity and costs while maintaining reliable electrical and thermal connections, enabling a compact and efficient semiconductor assembly.
Implementation Method 1
pressure is applied to that stack to ensure proper electrical and thermal contact between the individual press pack modules
Implementation Method 2
the insulation element is provided to electrically insulate the electrically conductive bus bar from the semiconductor module
Implementation Method 3
the cooler is arranged such that substantially the entire area of a side of the semiconductor module (20a) is in contact with the cooler
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A semiconductor assembly (10) comprises a stack (38) with a semiconductor module (20a) and a cooler (30a), wherein the semiconductor module (20a) is provided in contact with the cooler (30a). A clamping assembly (40) is adapted to exert a force (F) on the two sides of the stack. The stack is provided with a through hole (26, 36) between the two sides thereof and a part of the clamping assembly (40) comprises an electrically conductive part which extends through the through hole (26, 36) of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.