Power Semiconductor Bus Bar Layout for Flexible Module Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power semiconductor module arrangements face challenges in being produced cost-effectively and with high flexibility, particularly in the design and connection of bus bars which affect electrical and mechanical coupling.
Innovation Solution
The power semiconductor module arrangement includes a housing with a substrate having a dielectric insulation layer and a first metallization layer, where bus bars are electrically and mechanically coupled to the substrate, extending both inside and outside the housing, with identical outlines and configurations to ensure reliable and efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bus bars have different outlines and configurations to optimize electrical connections, then electrical performance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies homogeneity by making all bus bars identical in outline and configuration. This standardization allows for simplified manufacturing processes, reduced production costs, and easier assembly while still achieving the required electrical connection reliability through the consistent design that ensures proper alignment and coupling with the substrate's metallization layer
2Reliability
If bus bars are designed with complex configurations for optimal electrical coupling, then electrical performance improves, but device complexity increases
Solution Approach 1:
The patent reduces device complexity by using identical bus bar designs for all electrical connections. The consistent outline and configuration simplify the overall device architecture, making it easier to design, manufacture, and assemble while maintaining effective electrical coupling through the standardized interface with the substrate
3Strength
If different bus bar designs are used to optimize mechanical coupling, then mechanical stability is improved, but ease of assembly decreases
Solution Approach 1:
The patent improves ease of assembly by using identical bus bars with standardized outlines and configurations. This uniformity allows for simplified handling, consistent assembly procedures, and reduced training requirements for workers, while the design inherently provides adequate mechanical stability through the standardized coupling mechanism with the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a cost-effective and flexible production of power semiconductor modules with improved electrical and mechanical properties, enhancing the switching behavior and ease of assembly while maintaining high accuracy in current measurement.
Implementation Method 1
each of the plurality of bus bars is electrically coupled to the substrate with a first end
Implementation Method 2
the substrate including a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer
Data Source
Figure 1~2
Figure 3~4
Figure 5A~6
AI summary
A power semiconductor module arrangement comprises a housing, a substrate arranged in or forming a bottom of the housing, the substrate comprising a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer, a semiconductor arrangement arranged on the substrate, and a plurality of bus bars electrically coupled to each other by means of the semiconductor arrangement and/or the first metallization layer, each of the plurality of bus bars comprising a first end, a second end opposite the first end, a first surface having a first outline, and a second surface opposite the first surface, the second surface having a second outline that is a projection of the first outline, wherein the first end of each of the plurality of bus bars is electrically and mechanically coupled to the substrate, and the second end of each of the plurality of bus bars extends to the outside of the housing, each of the plurality of bus bars comprises a metal sheet, and the outline of the first surface of a bus bar is identical to the outline of the first surface of each of the other bus bars of the plurality of bus bars.