Semiconductor Terminal-Bus Bar Layout for Lower Inductance
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Solution Overview
Problem
Existing semiconductor devices with three-level inverter circuits face challenges in reducing inductance, particularly in portions of the circuit where currents flow perpendicular to the laminate substrate.
Innovation Solution
The semiconductor device incorporates a configuration with first and second power modules, each connected to bus bars, and terminals with planar portions arranged parallel to and opposite each other, with bus bars covering gaps between terminal portions to reduce inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If columnar terminals are arranged independently in portions where current flows perpendicular to the laminate substrate, then the circuit structure is simplified, but inductance increases
Solution Approach 1:
The bus bar is nested within the terminal structure, with the bus bar inserted into a groove of the terminal. This nesting arrangement allows the bus bar to cover the gap between terminal portions, reducing inductance while maintaining structural simplicity. The terminal effectively contains the bus bar, creating a compact integrated structure.
Solution Approach 2:
The bus bar acts as an intermediary element between the terminal portions connected to different power modules. By positioning the bus bar to cover the gap between terminal portions, it serves as a magnetic shield that reduces mutual inductance between adjacent terminals, thereby lowering overall circuit inductance.
2Reliability
If bus bars are added to cover gaps between terminal portions, then inductance is reduced, but device complexity increases
Solution Approach 1:
The bus bar is merged with the terminal structure by integrating it into the groove of the terminal. This combination eliminates the need for separate bus bar components in traditional configurations, as the terminal itself provides the mounting structure. The merging reduces the number of discrete parts while achieving the inductance reduction effect.
Solution Approach 2:
The bus bar is nested within the terminal groove, creating a compact integrated structure. This nesting approach allows the bus bar to be positioned precisely to cover the gap between terminal portions without requiring additional external mounting structures, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the inductance of the semiconductor device by minimizing mutual inductance and enhancing magnetic shielding, thereby improving the device's performance.
Implementation Method 1
one of the first bus bar and the second bus bar covers a gap between a portion of the first terminal connected to the first bus bar and a portion of the second terminal connected to the second bus bar in plan view
Data Source
AI summary
A semiconductor device includes a first bus bar, a second bus bar, a first terminal, and a second terminal. The first terminal includes one or more planar portions, and the second terminal includes one or more planar portions. The one or more planar portions of the first terminal and the one or more planar portions of the second terminal are arranged parallel to and opposite each other. One of the first bus bar and the second bus bar covers a gap between a portion of the first terminal connected to the first bus bar and a portion of the second terminal connected to the second bus bar in plan view.