Semiconductor Bus Bar Layout for Wire-Free Passive Element Connection

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Solution Overview

Problem

Existing semiconductor apparatuses require separate linear wires to connect switching elements and capacitive elements, complicating the manufacturing process.

Innovation Solution

A semiconductor apparatus design featuring first and second bus bars with protrusions that electrically connect to a circuit substrate, simplifying the manufacturing process by eliminating the need for separate wires.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate linear wires are used to connect switching elements and capacitive elements, then electrical connection is achieved, but the manufacturing process becomes complicated

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The bus bar integrates multiple functions into a single component: it provides electrical connection between switching elements and capacitive elements, serves as a structural support, and eliminates the need for separate linear wires. This merging of functions directly reduces manufacturing complexity while maintaining reliable electrical connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bus bar performs multiple roles simultaneously: it acts as an electrical conductor, a mechanical support structure, and a mounting platform for capacitive elements. This multi-functionality replaces what would otherwise require multiple separate components, thereby simplifying the manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If separate linear wires are used for connection, then electrical connectivity is established, but the number of components increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

Multiple separate components (linear wires for electrical connection and separate mounting structures) are merged into a single integrated bus bar component. This reduction in component quantity is achieved while preserving all necessary electrical connectivity functions through the bus bar's integrated design.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If separate linear wires are used, then electrical connection is provided, but assembly difficulty increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidassembly difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The bus bar combines electrical connection functionality with structural support and mounting capabilities into one component. This integration eliminates the need for separate assembly steps involving multiple wires and mounting structures, thereby easing the manufacturing and assembly process while ensuring reliable electrical connections.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12489095B2Semiconductor apparatus
Publication Date: 2025.12.02 FUJI ELECTRIC CO LTD
  • US12489095B2 patent drawing
  • US12489095B2 patent drawing
  • US12489095B2 patent drawing

AI summary

A semiconductor apparatus includes a first connection terminal and a second connection terminal, a drive circuit including one or more power semiconductor elements, a control circuit to control the one or more power semiconductor elements, a circuit substrate, a passive element on the circuit substrate, and a first bus bar and a second bus bar. The first bus bar includes a first body including a path electrically connecting the first connection terminal to the drive circuit, and a first protrusion protruding toward the circuit substrate against the first body. The second bus bar includes a second body including a path electrically connecting the second connection terminal and the drive circuit, and a second protrusion protruding toward the circuit substrate against the second body. The passive element is electrically connected to the first protrusion and to the second protrusion.