Semiconductor Package Cap and Frame for Heat Dissipation
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Solution Overview
Problem
Existing semiconductor device packaging methods face challenges in integrating a thermally conductive cap without additional process steps, which increases costs and manufacturing risks, especially when the cap is not effectively positioned to dissipate heat and reduce electromagnetic interference.
Innovation Solution
A method involving a substrate structure with linked substrate elements and a cap, frame, and contact structure, where the cap extends over semiconductor dies, and the frame elements are positioned to allow for encapsulation without extra process steps, with the cap and frame elements being thermally and electrically conductive to provide heat sinking and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive cap is integrated into the semiconductor device package, then heat dissipation and electromagnetic shielding are improved, but manufacturing cost increases and additional process steps are introduced
Solution Approach 1:
The patent combines the cap structure with the frame members and electrical contact surfaces into a single integrated component. The cap is formed as part of the same structure that provides mechanical support and electrical contacts, eliminating the need for separate cap integration steps while maintaining thermal conduction and electromagnetic shielding functions
Solution Approach 2:
The frame members serve multiple functions simultaneously: they provide mechanical support for the substrate elements, act as electrical contacts, and form the cap structure for thermal management and EMI shielding. This multi-functional design eliminates the need for separate components for each function, reducing manufacturing complexity
2Object-affected harmful factors
If the cap is positioned to effectively dissipate heat and shield from electromagnetic interference, then device performance is improved, but the active face of the die may not be directly under the cap, reducing effectiveness
Solution Approach 1:
The patent extends the cap structure laterally beyond the vertical projection of the die through the frame members. This lateral extension in the horizontal dimension allows the cap to provide EMI shielding and heat dissipation over a broader area, compensating for the die not being directly under the cap center
3Reliability
If frame members are used to support electrical contact surfaces, then electrical connections are improved, but the frame members must be cut off and discarded during singulation, increasing material waste
Solution Approach 1:
The patent designs the frame members to be segmented into individual device portions during singulation. Each device retains its associated frame members and electrical contact surfaces as integrated units, allowing the frame material to be fully utilized rather than discarded as waste
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective heat dissipation and electromagnetic interference reduction without additional manufacturing steps, reducing costs and risks while maintaining the benefits of a thermally conductive cap, even when the active face of the die is not directly under the cap.
Implementation Method 1
distributing internally generated heat over the face of the semiconductor die or dies and dissipating the heat, by conduction radiation and/or convection
Implementation Method 2
distributing internally generated heat over the face of the semiconductor die or dies and dissipating the heat, by conduction radiation and/or convection
Implementation Method 3
distributing internally generated heat over the face of the semiconductor die or dies and dissipating the heat, by conduction radiation and/or convection
Implementation Method 4
formed of an electrically conductive material and also function as an electromagnetic shield, typically in conjunction with an electrically conductive substrate beneath the semiconductor die or dies, in order to reduce electromagnetic interference effects
Data Source
AI summary
A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.