Semiconductor Package Cap With Integrated Electrical Leads
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Solution Overview
Problem
Conventional semiconductor device packages require a separate carrier for the semiconductor die, which increases thickness and costs, and may introduce defects.
Innovation Solution
A semiconductor device package design where the semiconductor die is secured to the inner surface of a cap with conductive interconnects or leads formed on the cap's sidewalls, eliminating the need for a separate carrier by allowing direct bonding to external circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate carrier is used to secure the semiconductor die, then the die can be properly supported and electrically connected, but the package thickness increases and costs increase
Solution Approach 1:
The patent combines the carrier and cap into a single integrated cap structure. The cap serves both as the protective enclosure and as the support structure for the semiconductor die, with electrical leads formed directly on the cap's inner surface. This eliminates the need for a separate carrier, thereby reducing package thickness while maintaining die support and electrical connection functionality.
Solution Approach 2:
The cap is designed to perform multiple functions: it provides mechanical support for the semiconductor die, serves as the protective enclosure, and incorporates electrical leads for electrical connection. By making the cap multi-functional, the patent eliminates the need for a separate carrier, reducing both thickness and cost while maintaining all necessary functions.
2Reliability
If a separate carrier is used to secure the semiconductor die, then the die can be properly supported and electrically connected, but manufacturing costs increase
Solution Approach 1:
The patent combines the carrier and cap into a single integrated cap structure with electrical leads formed directly on it. This reduces the total number of components and assembly steps, thereby lowering manufacturing costs while maintaining die support and electrical connection reliability.
Solution Approach 2:
The cap is designed to perform multiple functions including die support, enclosure, and electrical connection through integrated leads. This multi-functionality reduces component count and assembly complexity, leading to lower manufacturing costs while maintaining the necessary reliability.
3Reliability
If a separate carrier is used to secure the semiconductor die, then the die can be properly supported, but defects may be introduced
Solution Approach 1:
The patent combines the carrier and cap into a single integrated structure, eliminating the interface between separate components. This reduction in the number of components and assembly steps minimizes the opportunities for defects to be introduced during manufacturing and assembly, while maintaining proper die support.
4Length of stationary object
If the semiconductor die is secured to the cap's inner surface, then the package thickness is reduced, but the cap must be directly bonded to external circuitry
Solution Approach 1:
The patent combines the carrier and cap into a single integrated cap with electrical leads formed directly on it. This integration simplifies the bonding structure by providing direct electrical connection points on the cap itself, eliminating the need for additional carrier-based connection structures, thereby reducing package thickness without increasing complexity.
Data Source
AI summary
One or more embodiments are directed to semiconductor device packages having a cap with integrated metal interconnects or conductive leads. One embodiment is directed to a semiconductor device package that includes a cap having a cover extending along a first direction and sidewalls extending from the cover along a second direction that is transverse to the first direction. A plurality of electrical leads are disposed on inner surfaces of the sidewalls and extend over lower surfaces of the sidewalls. A semiconductor die is attached to an inner surface of the cover of the cap, and the semiconductor die is electrically coupled to the plurality of electrical leads.