Semiconductor Package Cap With Seal Ring Tread
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Solution Overview
Problem
Semiconductor packages introduce parasitic capacitance, inductance, and resistance, leading to increased electrical losses and performance degradation, especially at higher operational frequencies.
Innovation Solution
A semiconductor package design featuring a substrate with a non-conductive cap and a gap filled with air or gas, utilizing a 'tread' structure with columns and grooves for strong mechanical and electrical bonding, and a hermetic seal to minimize parasitic coupling, along with a multi-layer conductive material stack for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor package structure is used, then the device provides electrical connections through contacts on the package, but the packaging adds parasitic capacitance, parasitic inductance and parasitic resistance that increase electrical losses and adversely impact performance at higher frequencies
Solution Approach 1:
The patent extracts and removes the source of parasitic elements by eliminating the conventional package structure. The semiconductor device is presented without traditional packaging materials and contacts, directly exposing the device terminals to minimize parasitic capacitance, inductance, and resistance that would otherwise be introduced by package components.
Solution Approach 2:
The patent applies different structural configurations to different regions of the device. Various embodiments show different terminal arrangements, contact configurations, and structural optimizations at specific locations to minimize parasitic effects locally while maintaining overall device functionality and electrical performance.
2Ease of operation
If packaging materials and contacts are used to provide electrical connections, then the device is protected and connected, but the packaging adds parasitic elements that increase electrical losses
Solution Approach 1:
The patent removes the harmful packaging materials and conventional contact structures that generate parasitic elements. By extracting these components, the device maintains electrical connection functionality while eliminating the source of parasitic capacitance, inductance, and resistance that degrade performance.
Solution Approach 2:
The patent employs composite material structures in various embodiments, combining different materials with optimized properties to achieve low parasitic characteristics while maintaining mechanical strength and electrical conductivity. The use of composite structures allows simultaneous optimization of multiple properties to reduce harmful parasitic effects.
Data Source
AI summary
A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.