Semiconductor Capacitance Self-Testing Circuit
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Solution Overview
Problem
Capacitors integrated into semiconductor packages often experience shorts, opens, or capacitance variations due to production or assembly dispersion, making it difficult to ensure adequate capacitance levels for voltage stabilization, and existing testers can only detect shorts, requiring costly special equipment for open and capacitance variation detection.
Innovation Solution
Incorporating a capacitance measurement circuit within the semiconductor chip to perform self-testing of capacitor capacitance levels, allowing for detection of opens and capacitance variations without specialized testers by measuring voltage changes during discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a capacitor is implemented on a package, then voltage stabilization function is provided, but shorts, opens, and capacitance variation occur due to production or assembly dispersion
Solution Approach 1:
The patent performs capacitance measurement and defect detection before product shipment using a built-in measurement circuit. By conducting preliminary testing during manufacturing, defects such as shorts, opens, and capacitance variations are identified early, allowing for sorting and selection of capacitors within specified capacitance ranges before they reach customers, thus ensuring reliable voltage stabilization function.
2Difficulty of detecting and measuring
If a tester apparatus is used to detect capacitor defects, then short between electrodes can be detected, but open between electrodes and capacitance variation cannot be detected without costly special equipment
Solution Approach 1:
The patent implements a self-testing mechanism where the semiconductor device uses its own built-in capacitance measurement circuit to measure the capacitance of capacitors implemented on the same package. This self-service approach eliminates the need for costly special external testing equipment, as the device autonomously performs capacitance measurement, open detection, and defect identification using integrated circuits and electrodes already present in the device.
Solution Approach 2:
The built-in capacitance measurement circuit serves multiple functions: it measures capacitance values, detects open conditions, identifies short defects, and enables sorting of capacitors by capacitance level. By making the measurement circuit multi-functional, the patent eliminates the need for separate specialized testing equipment for each type of defect detection, thereby reducing device complexity and testing costs.
3Measurement precision
If conventional testing methods are used, then only short between electrodes can be detected at product shipment inspection, but open and capacitance variation remain undetected
Solution Approach 1:
The patent replaces complex external mechanical testing equipment with an integrated electrical measurement circuit built into the semiconductor device. The measurement circuit uses electrical signals and standard circuit components to perform capacitance measurement and defect detection, substituting the need for specialized external testing apparatus and thereby improving measurement precision while reducing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and cost-effective self-testing of capacitor capacitance levels, ensuring reliable voltage stabilization and reducing production costs by eliminating the need for specialized testing equipment.
Implementation Method 1
the capacitance measurement circuit measures a level of capacitance of the capacitor via the electrode of the semiconductor chip
Implementation Method 2
measuring voltage changes during discharge
Data Source
AI summary
According to one embodiment, there is provided a semiconductor device including a package, a semiconductor chip, and a capacitor. The semiconductor chip has an electrode. The semiconductor chip is implemented in the package. The capacitor is implemented in the package. One terminal of the capacitor is electrically connected to the electrode of the semiconductor chip. Another terminal of the capacitor is electrically connected to a ground terminal of the package. The semiconductor chip includes a capacitance measurement circuit. The capacitance measurement circuit measures a level of capacitance of the capacitor via the electrode of the semiconductor chip.