Semiconductor Capacitor With Segmented Doping For High Quality Factor

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Solution Overview

Problem

Current semiconductor capacitors face challenges in achieving a high quality factor (Q) and tuning range while maintaining control over capacitance, often requiring tradeoffs that degrade device performance.

Innovation Solution

A semiconductor capacitor design with regions of different doping concentrations and types, along with a control voltage mechanism, is implemented to adjust capacitance, improving the quality factor and tuning range by modulating depletion regions and electric field distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a variable capacitor is used to adjust capacitance in LC circuits, then the resonance frequency can be tuned, but the quality factor deteriorates due to the inherent tradeoff in conventional designs

Engineering Contradiction:
Improvetuning rangeVSAvoidquality factor
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The semiconductor region is divided into multiple doped regions (first doped region, second doped region, third doped region) with different doping types and concentrations. This segmentation allows independent control of depletion regions at different locations, enabling capacitance tuning while maintaining high quality factor by optimizing each region's contribution to the overall device performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the semiconductor structure are assigned different doping characteristics (types and concentrations) to create localized electric field distributions. The first doped region, second doped region, and third doped region each have tailored doping profiles that optimize their respective roles in capacitance modulation while minimizing losses, thereby achieving both wide tuning range and high quality factor.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conventional semiconductor capacitor structures are used, then manufacturing is simplified, but the quality factor and tuning range are limited due to structural constraints

Engineering Contradiction:
Improvestructural simplicityVSAvoidquality factor
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The capacitor structure is segmented into distinct doped regions within the semiconductor substrate, each with specific doping types and concentrations. This segmentation enables sophisticated electrical characteristics to be achieved while maintaining compatibility with standard semiconductor fabrication processes, thus improving quality factor without significantly complicating manufacturing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention utilizes variations in doping concentration and doping type as key parameters to optimize capacitor performance. By changing these parameters across different regions (first, second, and third doped regions), the device achieves enhanced quality factor and tuning range while remaining manufacturable using conventional semiconductor processing techniques.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If depletion regions are modulated to achieve capacitance adjustment, then tuning range is improved, but control voltage requirements increase leading to higher power consumption

Engineering Contradiction:
Improvetuning rangeVSAvoidcontrol voltage
Core Design Contradiction:
Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

By creating localized doping variations in specific regions of the semiconductor substrate, the invention optimizes the electric field distribution to achieve efficient capacitance modulation. The tailored doping profiles in different regions enable effective depletion region control at lower voltage levels, expanding tuning range while reducing power consumption compared to uniform structures.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention exploits changes in doping concentration and type as key parameters to enhance the sensitivity of capacitance modulation. By optimizing these parameters in the doped regions, the device achieves wider tuning range with reduced control voltage requirements, thereby lowering power consumption while maintaining efficient capacitance adjustment capability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances the quality factor and tuning range of semiconductor capacitors, allowing for sharper capacitance transitions and improved device performance without significant degradation, benefiting applications such as digital tuning and high-voltage operations.

Implementation Method 1

the thickness of a depletion region formed in a p-n junction diode is varied by changing a bias voltage to alter the junction capacitance

Methodology Applied
Scientific EffectDepletion region modulation: Capacitance

Implementation Method 2

devices used as variable capacitance diodes are designed with a large junction area and a doping profile specifically chosen to improve the device performance

Methodology Applied
Scientific EffectVaractor effect: Capacitance

Data Source

PatentUS10211347B2Transcap device architecture with reduced control voltage and improved quality factor
Publication Date: 2019.02.19 QUALCOMM INC
  • US10211347B2 patent drawing
  • US10211347B2 patent drawing
  • US10211347B2 patent drawing

AI summary

Certain aspects of the present disclosure provide a semiconductor capacitor. The semiconductor capacitor generally includes an insulative layer, and a semiconductor region disposed adjacent to a first side of the insulative layer. The semiconductor capacitor also includes a first non-insulative region disposed adjacent to a second side of the insulative layer. In certain aspects, the semiconductor region may include a second non-insulative region, wherein the semiconductor region includes at least two regions having at least one of different doping concentrations or different doping types, and wherein one or more junctions between the at least two regions are disposed above or below the first non-insulative region.