Semiconductor Die Carrier Cleaning via Tandem Brushes and Vacuum
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Solution Overview
Problem
Current semiconductor die carrier inspection and cleaning processes rely heavily on visual examination, which is inefficient and prone to errors due to the presence of debris and contaminants, necessitating a more systematic and thorough method for defect detection and surface preparation.
Innovation Solution
A multi-station cleaning and inspection system that utilizes rotating brushes and vacuum lines to clean and inspect semiconductor die carriers, including top, side, and back surfaces, followed by warpage measurement, ensuring thorough removal of contaminants and accurate visual inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If visual examination is used for carrier inspection, then the inspection process is simple to perform, but the detection accuracy is reduced due to debris and contaminants on surfaces
Solution Approach 1:
The system performs cleaning operations before inspection to remove debris and contaminants from carrier surfaces. This preliminary cleaning action ensures that the subsequent visual examination can proceed with high accuracy without interference from contaminants, resolving the contradiction between operational simplicity and detection precision.
Solution Approach 2:
The patent introduces an intermediary cleaning system that includes vacuum lines, blowers, and brushes positioned between the carrier loading and inspection stages. This intermediary system mediates between the dirty carrier state and the clean inspection requirement, enabling both simple operation and high detection accuracy.
2Device complexity
If manual cleaning and inspection methods are used, then the equipment complexity is low, but the productivity and thoroughness of the process are insufficient
Solution Approach 1:
The inspection system is divided into multiple independent stations including cleaning stations, inspection stations, and warpage measurement stations. Each station performs a specific function, allowing parallel processing of multiple carriers and significantly increasing productivity while maintaining manageable system complexity through modular design.
Solution Approach 2:
The conveyor-based multi-station system serves multiple functions: cleaning carriers with vacuum lines and blowers, inspecting for defects with cameras, measuring warpage with sensors, and transporting carriers between stations. This multi-functional integration increases productivity without proportionally increasing complexity.
3Reliability
If comprehensive multi-surface inspection is performed, then the defect detection coverage is improved, but the inspection time and process complexity increase
Solution Approach 1:
The conveyor system enables continuous inspection where carriers move continuously through cleaning and inspection stations. Multiple surfaces (top, bottom, sides) are inspected in a continuous flow rather than discrete batch operations, improving defect detection coverage across all surfaces while maintaining efficient throughput and minimizing idle time.
Solution Approach 2:
The system inspects carriers in multiple spatial dimensions by examining top surfaces, bottom surfaces, and side surfaces at different stations. This multi-dimensional inspection approach ensures comprehensive defect coverage without requiring sequential manual inspection of each surface, thereby maintaining efficiency while improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cleans and inspects semiconductor die carriers, enhancing the accuracy of defect detection and surface preparation, thereby improving the reliability and efficiency of the inspection process and enabling reliable use in semiconductor manufacturing.
Implementation Method 1
A multi-station cleaning and inspection system that utilizes rotating brushes and vacuum lines to clean and inspect semiconductor die carriers
Implementation Method 2
A multi-station cleaning and inspection system that utilizes rotating brushes and vacuum lines to clean and inspect semiconductor die carriers
Data Source
AI summary
A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.