Semiconductor Carrier With Removable Film For Alignment
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Solution Overview
Problem
Conventional carrier structures for semiconductor chips face challenges such as alignment errors due to chip shifts, excess adhesive material spilling, and stress between materials, which hinder miniaturization and complicate manufacturing processes.
Innovation Solution
A method involving a carrier board with a through cavity and a removable film to temporarily fix the chip, using a sandwich structure with an inner adhesive layer to fill gaps and prevent adhesive spillage, and forming a built-up structure to disperse stress between materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive material is used to fill the gap between the chip and the carrier board, then the chip is securely fixed, but excess adhesive material spills out of the gap prior to solidification, complicating the manufacturing process
Solution Approach 1:
A removable film is introduced as an intermediary element between the chip and the carrier board. The film is positioned to cover the gap opening, preventing adhesive material from spilling out during the fixation process. After the adhesive solidifies and secures the chip, the removable film is taken away, leaving a clean structure without excess adhesive. This mediator solves the problem of adhesive spillage without requiring complex containment structures.
2Manufacturing precision
If the chip is temporarily fixed using a removable film, then alignment accuracy is improved and adhesive spillage is prevented, but an additional step of removing the film is required
Solution Approach 1:
The removable film is applied in advance, before the adhesive material is introduced. This preliminary action serves dual purposes: it provides a stable platform for precise chip alignment and simultaneously acts as a barrier to prevent adhesive spillage. By performing these functions beforehand, the film simplifies the overall process despite adding an initial step, as it eliminates the need for complex alignment mechanisms and adhesive containment structures.
3Ease of manufacture
If the carrier board uses a single-layer structure, then the manufacturing process is simpler, but stress between different materials causes warpage, delamination, or popcorn
Solution Approach 1:
The carrier board is constructed as a multi-layer composite structure, combining multiple material layers with different properties. This composite construction allows for better stress distribution and compensation between layers, preventing warpage, delamination, and popcorn defects that occur in single-layer structures. The layered design maintains manufacturing feasibility while significantly improving structural reliability and dimensional stability.
Data Source
AI summary
A carrier structure for a semiconductor chip and a method for manufacturing the same are disclosed. The method includes the following steps: providing a carrier board having at least one through cavity, wherein a removable film is formed on the surface of the carrier board, and a semiconductor chip is temporarily fixed in the through cavity by the removable film; filling the gap between the through cavity of the carrier board and the semiconductor chip with an adhesive material in order to fix the semiconductor chip; and removing the removable film. The disclosed method can reduce the alignment error resulted from the tiny shift of the semiconductor chip caused by jitters before the semiconductor is fixed in the cavity, thereby to increase the accuracy of the alignment, to facilitate fine wiring, and to meet the trend toward compact size of semiconductor packages.