Semiconductor Carrier Gas Chamber Layout for Faster Dry Gas Purging
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Solution Overview
Problem
Conventional semiconductor carriers have large buffer gas chambers leading to slow inflation speed and high VOC concentrations, necessitating frequent dry gas supplementation and large sealing peripheries.
Innovation Solution
A semiconductor carrier design with small volume gas chambers and improved airtightness, utilizing elastic sealing members and annular grooves to enhance gas circulation efficiency and reduce VOC concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a large volume buffer gas chamber is used to accommodate multiple diffusion tubes and through holes, then the sealing periphery becomes large and complex, but the inflation speed becomes slow and VOC concentration increases
Solution Approach 1:
The patent divides the single large buffer gas chamber into multiple independent small gas chambers, each corresponding to one through hole and diffusion tube. This segmentation reduces the volume of each chamber while maintaining the overall functionality, thereby improving inflation speed and reducing VOC concentration in each segment.
Solution Approach 2:
Each small gas chamber is designed with localized sealing structures (annular grooves with elastic sealing members) tailored to its specific position and requirements. This allows optimized sealing periphery for each local region rather than requiring a large continuous sealing perimeter, improving both inflation speed and sealing efficiency.
2Adaptability or versatility
If multiple diffusion tubes share the same buffer gas chamber, then the chamber volume must be large, but this results in slow gas circulation and high VOC concentration
Solution Approach 1:
The patent separates the gas distribution system into multiple independent gas chambers, each serving one diffusion tube. This eliminates the need for a large shared chamber and reduces VOC concentration by isolating gas sources and improving circulation efficiency in each small chamber.
Solution Approach 2:
Each small gas chamber acts as an intermediary between the external gas supply and the diffusion tube, enabling controlled gas distribution while maintaining small volume and low VOC concentration. The elastic sealing members in annular grooves serve as intermediaries for airtight connection without requiring large sealing peripheries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances dry gas inflation speed, reduces VOC emissions, and maintains low humidity within the accommodating chamber, improving the quality of the dry gas input.
Implementation Method 1
an elastic sealing member, providing airtightness between the gas supply portion and the bottom of the housing
Data Source
AI summary
A semiconductor carrier includes an accommodating chamber formed within a housing, wherein the housing has multiple through holes in communication with the accommodating chamber. A bottom plate is disposed at a bottom of the housing, and includes multiple gas supply portions each corresponding to one of the through holes. Each of the gas supply portions includes an elastic sealing member, which provides airtightness between the gas supply portion and the bottom of the housing. A gas chamber is located on the inside of the elastic sealing member, and the gas chamber and the through holes are in communication with each other to form a gas buffer channel. An installation groove is in communication with the gas chamber, and is configured to be disposed with a gas valve for receiving a gas into the accommodating chamber through the gas buffer channel.