Semiconductor Carrier Unit Posture Stabilization
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Solution Overview
Problem
Existing carrier units for semiconductor devices face challenges in ensuring uniform contact and proper pressure of bare chip electrodes with bumps on the electrode sheet, particularly for varying chip sizes, leading to unreliable electrical connections due to potential inclination and pressure distribution issues.
Innovation Solution
A carrier unit with an electrode sheet featuring a posture-stabilizing member that ensures the bare chip is positioned parallel to the bump-forming surface, using a housing member to accommodate the electrode sheet and posture-stabilizing member, which stabilizes the chip's posture and maintains uniform contact with bumps irrespective of chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If dummy bumps are provided adjacent to the bumps on the electrode sheet to stabilize the bare chip posture, then the chip inclination is reduced, but the contact area between the bare chip and electrode sheet is reduced
Solution Approach 1:
The patent introduces a posture stabilizing member as an intermediary element between the electrode sheet and the bare chip. This member includes positioning protrusions that contact the bare chip to prevent inclination, while maintaining the functional bumps for electrical connection. The stabilizing member acts as a mediator that provides mechanical support without interfering with the electrical contact function.
Solution Approach 2:
The patent divides the functions of the electrode sheet into separate elements: functional bumps for electrical connection and positioning protrusions on the posture stabilizing member for mechanical support. This segmentation allows the electrical contact function and mechanical stabilization function to be performed by different structures, avoiding interference between them.
2Reliability
If the pressing lid applies pressure to the bare chip to ensure contact, then electrical connection is improved, but the pressure distribution becomes uneven causing some bumps to exceed contact pressure
Solution Approach 1:
The patent implements preliminary positioning action through the posture stabilizing member before the pressing operation. The positioning protrusions pre-establish the correct orientation and position of the bare chip, ensuring that subsequent pressing force is distributed evenly across all contact points. This preliminary action prevents the need for excessive pressing force that would cause uneven pressure distribution.
Solution Approach 2:
The patent changes the geometric parameters of the positioning structure by providing positioning protrusions with specific dimensions and positions on the posture stabilizing member. These parameter adjustments ensure optimal contact between the positioning protrusions and the bare chip, leading to uniform pressure distribution during pressing while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable and uniform electrical connections by maintaining the bare chip's posture parallel to the electrode sheet, preventing inclination and ensuring consistent pressure distribution across the bumps, thus enhancing the stability and efficiency of the semiconductor device's electrical connections.
Implementation Method 1
an elastic sheet (6) in said recess (36R)
Implementation Method 2
a plurality of springs (24) arranged in a space between a base (26B) of the pressing body (26) and an inner surface of a lid body (20B), for biasing the pressing body (26) to the bare chip (38)
Data Source
AI summary
In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.