Semiconductor Carrier Recess for Damage Reduction
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Solution Overview
Problem
The manufacturing of semiconductor packages, particularly flip chip scale packages, faces challenges such as high risk of damage during transportation and transitions between operations, leading to yield loss and material wastage due to complex handling and assembly processes.
Innovation Solution
An apparatus comprising a holder and a supporting base is designed to securely hold and manage semiconductor carriers, utilizing various configurations like through holes, recesses, and interconnection structures to reduce handling risks and streamline manufacturing operations, thereby minimizing damage and material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor packages are transported and transferred between operations using traditional supporters, then manufacturing operations can proceed, but the risk of damage increases and yield is lost
Solution Approach 1:
The patent introduces a specialized carrier as an intermediary device between manufacturing operations. This carrier is specifically designed to securely hold semiconductor packages during transportation and transfer operations, reducing damage risk while maintaining manufacturing throughput.
Solution Approach 2:
The carrier incorporates protective structures and cushioning elements beforehand to prevent damage during subsequent transportation operations. The design anticipates potential damage risks and provides preventive protection through proper packaging and support structures.
2Adaptability or versatility
If complex assembly operations are performed on semiconductor packages, then device functionality is improved, but handling complexity increases and damage risk rises
Solution Approach 1:
The carrier is designed as a universal platform that can accommodate various semiconductor package configurations and support multiple manufacturing operations. This multi-functional design reduces the need for specialized handling equipment for different package types, simplifying overall handling complexity.
Solution Approach 2:
The carrier design segments the handling function from the manufacturing operation, allowing complex assembly operations to be performed on the semiconductor packages while the carrier manages the simpler task of secure transportation and positioning.
3Ease of operation
If traditional handling methods are used for semiconductor packages, then operations can be performed, but material wastage increases due to damage
Solution Approach 1:
The specialized carrier acts as a protective intermediary between the handling process and the semiconductor packages, maintaining ease of operation while preventing damage that would lead to material wastage.
Solution Approach 2:
Protective measures are built into the carrier design beforehand to prevent damage during handling operations, thereby reducing material wastage while maintaining operational ease.
Data Source
AI summary
An apparatus for manufacturing a semiconductor device includes a holder for holding a carrier and a supporting base for receiving the holder comprising a recess for accommodating a plurality of balls mounted on a surface of the carrier. Furthermore, a method of manufacturing a semiconductor device includes providing a carrier, providing an apparatus comprising a supporting base including a recess, holding the carrier on the supporting base and accommodating a plurality of balls mounted on a surface of the carrier in the recess.