Semiconductor Package Carrier Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, which affect the stability and performance of electronic devices.
Innovation Solution
A method involving a permanently coupled carrier, typically made of silicon or metal with a lower thermal coefficient of expansion than copper, is used to support semiconductor dies, inhibiting warpage and enhancing reliability by providing stable support and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases and package size increases
Solution Approach 1:
The patent employs a composite package structure integrating semiconductor die, carrier substrate, encapsulant material, and solder bumps in a unified assembly. This composite approach enhances reliability by distributing mechanical and thermal stresses across multiple materials with complementary properties, rather than relying on a single material system.
Solution Approach 2:
The patent transitions from planar package layouts to three-dimensional stacked configurations, where semiconductor die are vertically arranged and interconnected via solder bumps and conductive vias. This vertical integration reduces the lateral footprint while maintaining functional complexity, effectively decoupling device density from package area.
2Reliability
If conventional packaging methods are used, then manufacturing cost is lower, but reliability decreases
Solution Approach 1:
The patent performs preliminary bonding of semiconductor die to the carrier substrate using solder bumps before final encapsulation. This pre-assembly step establishes robust electrical and mechanical connections that can withstand subsequent processing, ensuring reliability is built into the structure before final packaging operations.
Solution Approach 2:
The patent combines multiple functions into integrated components: the encapsulant material simultaneously provides mechanical protection, environmental sealing, and structural support; the carrier substrate integrates electrical interconnection and mechanical mounting functions. This functional integration reduces the number of discrete manufacturing steps while enhancing overall package reliability.
3Reliability
If standard carrier materials are used, then manufacturing is easier, but warpage occurs and reliability decreases
Solution Approach 1:
The patent modifies the thermal and mechanical parameters of the carrier substrate by selecting materials with specific coefficients of thermal expansion (CTE) that match or complement the semiconductor die. This parameter matching minimizes differential thermal stress during temperature cycling, preventing warpage and maintaining package flatness and reliability.
Solution Approach 2:
The patent explicitly addresses thermal expansion effects by choosing carrier materials whose CTE characteristics compensate for expansion differences between dissimilar materials in the package stack. This thermal management strategy prevents warpage induced by temperature variations, ensuring stable mechanical and electrical performance throughout the product lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability and reduces costs by stabilizing semiconductor devices, preventing warpage, and effectively managing heat, thus enhancing the performance and longevity of electronic devices.
Implementation Method 1
A method involving a permanently coupled carrier, typically made of silicon or metal with a lower thermal coefficient of expansion than copper, is used to support semiconductor dies, inhibiting warpage
Implementation Method 2
providing stable support and efficient heat dissipation
Data Source
AI summary
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various electronic devices, and methods of making thereof, that comprise a permanently coupled carrier that enhances reliability of the electronic devices.