Semiconductor Carrier Stabilization and Warpage Suppression

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Solution Overview

Problem

Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, which are not adequately addressed by existing technologies.

Innovation Solution

The implementation of a semiconductor device with a permanently coupled carrier that provides stable support and suppresses warpage, using materials like silicon or metal with a lower thermal coefficient of expansion than copper, and includes a manufacturing method involving the coupling of semiconductor dies to a substrate, encapsulation, and attachment of a carrier to the top surfaces of the dies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases and package size increases

Engineering Contradiction:

ImprovereliabilityVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The semiconductor device is divided into multiple functional layers: substrate, semiconductor dies, encapsulant, and carrier. Each layer performs a specific function, allowing the complex system to be managed through modular segmentation while achieving improved reliability through permanent carrier coupling.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The device employs composite material structures including the combination of substrate, encapsulant material, and carrier with different thermal expansion coefficients. This composite approach resolves the contradiction by providing both structural integrity and thermal stability, improving reliability without excessive complexity.

Inventive Principle:

Principle #40Composite materials

2Reliability

If conventional packaging is used, then manufacturing costs are lower, but reliability decreases

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The carrier is permanently coupled to the substrate before mounting the semiconductor dies. This preliminary action ensures structural stability and reliability from the outset, preventing reliability issues that would otherwise require costly rework or replacement later in the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention changes the thermal expansion parameter by selecting carrier and substrate materials with matched thermal expansion coefficients. This parameter optimization improves reliability under thermal cycling conditions while maintaining manufacturing feasibility through standard material selection processes.

Inventive Principle:

Principle #35Parameter changes

3Volume of moving object

If conventional packages are used, then package size is larger, but manufacturing is easier

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing process

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The invention transitions from conventional planar packaging to a multi-layer vertical structure with substrate, dies, encapsulant, and carrier stacked in different dimensions. This dimensional reorganization reduces the horizontal package footprint while maintaining manufacturing simplicity through established vertical stacking processes.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Reliability

If semiconductor dies are mounted without permanent carrier coupling, then manufacturing is simpler, but reliability decreases due to warpage

Engineering Contradiction:

Improvestability of semiconductor diesVSAvoidcarrier coupling structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The carrier and substrate are specifically selected to have matched thermal expansion coefficients, creating a thermally stable assembly that prevents warpage during thermal cycling. This thermal expansion matching provides permanent structural coupling that improves die stability without requiring complex additional restraint mechanisms.

Inventive Principle:

Principle #37Thermal expansion

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability of semiconductor devices by stabilizing the semiconductor dies and efficiently dissipating heat, while also reducing package size and costs.

Implementation Method 1

a permanently coupled carrier that enhances reliability of the electronic devices... using materials like silicon or metal with a lower thermal coefficient of expansion than copper

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

efficiently dissipating heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9818721B2Semiconductor device and manufacturing method thereof

Publication Date: 2017.11.14 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various electronic devices, and methods of making thereof, that comprise a permanently coupled carrier that enhances reliability of the electronic devices.