Semiconductor Module Case Molding to Prevent Resin Cracks and Voids
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Solution Overview
Problem
Existing semiconductor module manufacturing methods face challenges in preventing cracks and voids during resin molding of the case, which can compromise the structural integrity and electrical performance.
Innovation Solution
A method involving a molding die with rod-shaped mold pins and injection ports is used to form tubular fastening holes in the case, ensuring the mold pins are perpendicular to the molding bottom surface at corners, and rod-shaped second die components are positioned between mold pins and injection ports to facilitate precise molding of the case's outer frame and housing region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mold pins are positioned at corners of the molding space, then fastening holes are formed at corners of the outer frame, but cracks and voids may occur during resin molding
Solution Approach 1:
Rod-shaped second die components are introduced as intermediary elements positioned between the mold pins and the molding inner surface. These second die components act as mediators that prevent direct contact between the molding material flow and the mold pins, thereby eliminating the formation of cracks and voids while still enabling precise positioning of fastening holes at the corners of the outer frame.
2Productivity
If injection ports are positioned at periphery of molding outer surface, then resin flow is facilitated, but cracks and voids may form near injection ports
Solution Approach 1:
The rod-shaped second die components are positioned between the injection ports and the molding inner surface, serving as intermediaries that guide the resin flow smoothly. This prevents the formation of cracks and voids near the injection ports while maintaining efficient resin injection through the peripherally positioned injection ports.
3Manufacturing precision
If mold pins are disposed vertically at corners, then fastening holes are properly formed, but stress concentration occurs during molding
Solution Approach 1:
The rod-shaped second die components positioned between the mold pins and molding inner surface act as stress-distributing intermediaries. They prevent stress concentration at the corners where mold pins are vertically disposed, while still enabling proper formation of fastening holes with correct geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes cracks and voids during resin molding, enhancing the structural integrity and electrical connectivity of the semiconductor module.
Implementation Method 1
a molding die including a first die component having a cavity corresponding to a shape of an exterior of a case and injection ports that communicate with the cavity from outside the first die component
Implementation Method 2
rod-shaped mold pins for forming tubular fastening holes in the case, into which screws are to be fastened
Data Source
AI summary
A molding space includes a molding inner surface defining an outer frame and a housing region, a molding outer surface provided outside the molding inner surface and having injection ports, which communicate with the molding space, formed at positions inwardly separated from end portions, and a molding bottom surface that connects the molding inner surface and the molding outer surface and contacts a bottom surface of the outer frame. Mold pins are disposed perpendicular to the molding bottom surface at corners of the molding space in plan view. During injection, rod-shaped second mold components are positioned parallel to the mold pins between the mold pins and the injection ports in the molding space and closer to the molding inner surface than the molding outer surface in plan view.