Semiconductor Chip Casting Geometry via Sawing
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Solution Overview
Problem
Current methods for manufacturing radiation-emitting semiconductor devices are complex and do not allow for precise definition of the geometry of the casting compounds, leading to larger device designs and inefficiencies in radiation emission.
Innovation Solution
A method involving the use of an auxiliary carrier with semiconductor chips, where casting compounds are applied and separated using sawing to create wavelength-converting and reflective layers with oblique outer surfaces, allowing for precise geometry definition and elimination of prefabricated housings, resulting in smaller device designs and improved radiation emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If current manufacturing methods are used for radiation-emitting semiconductor devices, then the devices can be produced, but the manufacturing process is complex and the geometry of casting compounds cannot be precisely defined
Solution Approach 1:
The manufacturing process segments the casting compound formation into distinct steps: applying the casting compound in a first state, sawing through it in a second state, and forming the final geometry. This segmentation allows precise control over the geometry definition while maintaining process feasibility, resolving the contradiction between manufacturing precision and process complexity.
2Volume of moving object
If traditional device designs are used, then the devices can be assembled, but the device size is larger due to prefabricated housings
Solution Approach 1:
The patent merges the housing function with the casting compound itself. The casting compound serves both as a structural element and as the housing that encapsulates the semiconductor chip. This elimination of separate prefabricated housings reduces device size while maintaining structural integrity and ease of manufacture.
3Productivity
If casting compounds are applied without precise geometry control, then the manufacturing is simpler, but the radiation emission characteristics are not enhanced
Solution Approach 1:
The casting compound is applied in a preliminary state that allows for subsequent processing. The compound is first applied in a moldable state, then sawn through in a different state to achieve the final precise geometry. This preliminary action enables both manufacturing simplicity and final geometric precision for enhanced radiation emission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the manufacturing process, enables precise geometry definition of the casting compounds, and results in smaller radiation-emitting semiconductor devices with enhanced radiation emission characteristics.
Implementation Method 1
The first casting compound is wavelength-converting and the semiconductor chip compound is separated such through the first casting compound that a wavelength-converting layer is formed on the radiation exit surface and the side faces of each semiconductor chip
Implementation Method 2
the first casting compound and/or the second casting compound is separated by sawing, so that by sawing the first casting compound and/or the second casting compound, an oblique outer surface is formed, which preferably has a convex curvature
Data Source
AI summary
A method for producing a plurality of radiation-emitting semiconductor components and a radiation-emitting semiconductor component are disclosed. In an embodiment a method includes providing an auxiliary carrier, applying a first structured wavelength converting layer to the auxiliary carrier comprising a plurality of structural elements, filling regions between the structural elements with a first reflective casting compound and applying a radiation-emitting semiconductor chip with its front side to one structural element of the first structured wavelength converting layer in each case.