Semiconductor Cavity Formation via Columnar Adhesive Segmentation
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Solution Overview
Problem
Existing semiconductor devices face quality degradation due to the adhesive layer interfering with light-receiving or light-emitting components, as it obstructs incident light or emits light, and is prone to deterioration, making it difficult to control the formation of a cavity between the semiconductor substrate and the supporting member.
Innovation Solution
The formation of columnar structures around the region where a cavity is needed allows the adhesive layer to gather around these structures, preventing it from depositing in the desired area, thus facilitating the creation of a cavity between the semiconductor substrate and the supporting member, which seals the device component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is uniformly formed on the semiconductor substrate to bond the supporting member, then the bonding strength is improved, but the adhesive layer obstructs incident light to device components and degrades operational quality
Solution Approach 1:
The adhesive layer is segmented into specific regions using columnar structures as boundaries. The adhesive is applied only in peripheral regions surrounding the columnar structures, while the central region containing device components remains free of adhesive. This segmentation allows bonding strength to be maintained at the periphery while preventing light obstruction in the central region.
Solution Approach 2:
Different regions of the semiconductor substrate are assigned different properties: peripheral regions have adhesive layers for bonding, while central regions have no adhesive to allow light transmission. The columnar structures create this local differentiation, ensuring each region has the quality needed for its specific function.
2Object-affected harmful factors
If a cavity is provided between the semiconductor substrate and supporting member to prevent adhesive interference, then light transmission is improved, but it becomes difficult to control the location where the adhesive layer forms
Solution Approach 1:
Columnar structures are formed on the semiconductor substrate before applying the adhesive layer. These pre-formed structures serve as physical barriers and guides that automatically direct the adhesive to specific peripheral regions. This preliminary action simplifies the subsequent adhesive application process and ensures precise location control without complex masking or alignment procedures.
Solution Approach 2:
The columnar structures act as intermediary elements between the semiconductor substrate and the adhesive layer. They mediate the adhesive application process by providing physical boundaries that guide adhesive flow and prevent it from entering the central cavity region, thereby controlling adhesive location without requiring direct precision control during application.
3Ease of manufacture
If the adhesive layer is made fluid to facilitate application, then ease of application is improved, but the device component's fine structure makes it difficult to control adhesive placement
Solution Approach 1:
The columnar structures serve as intermediary physical barriers that control adhesive placement. The adhesive's fluidity allows it to flow and conform to the available space, while the columnar structures guide this flow into the desired peripheral regions. This combination of fluid adhesive and structured guidance achieves both ease of application and precise placement.
Solution Approach 2:
The adhesive material itself performs the placement function through its natural fluid flow characteristics. When applied to the substrate with columnar structures present, the adhesive automatically flows into the peripheral regions and stops at the columnar boundaries without requiring external control mechanisms. The system uses the adhesive's own properties to achieve precise placement.
Data Source
AI summary
This invention is directed to offer a semiconductor device in which a cavity space is easily provided in a specific region when a supporting member is bonded to a semiconductor substrate through an adhesive layer, and its manufacturing method. A resist layer is applied to an entire top surface of the semiconductor substrate 2, and exposure to transfer a pattern is performed. By subsequent development and selective removal of the resist layer, the resist layer is formed into a shape of a plurality of columnar structures 4. Then, an adhesive material made of an epoxy resin or the like is applied to the entire top surface of the semiconductor substrate 2. The adhesive material is gathered around the columnar structures 4 by itself to form an adhesive layer 5. Therefore, in contrast, the adhesive layer 5 does not deposit in a region where the cavity is to be formed. Then, the supporting member 6 is bonded through the columnar structures 4 and the adhesive layer 5. By bonding the supporting member 6, there is formed the cavity 7 surrounded with the semiconductor substrate 2, the columnar structures 3 and the supporting member 6.