Semiconductor Package Cavity Stacking for Compact Reliable Interconnects
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor device design featuring a substrate with conductive pads and a cavity, coupled with a base electronic component having inner and outer short bumps and tall bumps, and a mounted electronic component, where the tall bumps are connected to the substrate pads, and an underfill material is used to secure the components, allowing for a compact and reliable package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and performance is low
Solution Approach 1:
The patent transitions from a conventional two-dimensional planar arrangement to a three-dimensional stacked architecture. Multiple electronic components are vertically stacked and interconnected through through-substrate vias, enabling compact packaging while maintaining functional complexity. This dimensional change resolves the contradiction by achieving small package size without sacrificing device capability.
Solution Approach 2:
The patent implements a nested structure where electronic components are stacked vertically within a compact footprint. The first electronic component is positioned on the first substrate, with a second electronic component stacked above it, interconnected through vertical vias. This nesting approach minimizes package volume while preserving functional complexity.
2Reliability
If conventional semiconductor packages are used, then manufacturing process is traditional, but reliability is decreased
Solution Approach 1:
The patent employs preliminary bonding actions where electronic components are pre-bonded to substrates using advanced techniques such as copper pillar bonding and underfill application before final assembly. Through-substrate vias are pre-formed and filled with conductive material to establish reliable electrical interconnections. These preliminary actions enhance reliability while maintaining manufacturing feasibility through standardized processes.
Solution Approach 2:
The patent utilizes composite material structures including copper pillars combined with solder bumps, underfill materials with specific mechanical properties, and multi-layer substrate composites. These composite structures provide enhanced mechanical strength, thermal management, and electrical performance, improving reliability while using established manufacturing techniques.
3Reliability
If conventional semiconductor packages are used, then cost is lower, but performance is relatively low
Solution Approach 1:
The patent segments the interconnection structure into distinct functional elements: copper pillars for mechanical and electrical support, solder bumps for electrical bonding, and through-substrate vias for vertical interconnection. Each segment is optimized for its specific function, ensuring reliable electrical connections while managing complexity through modular design and standardized fabrication processes.
Data Source
AI summary
An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.