Semiconductor Ceiling Suspension Mechanism for Automated Assembly
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Solution Overview
Problem
The existing manual assembly and unloading processes for semiconductor equipment ceilings are labor-intensive, require substantial manpower, and may not ensure secure attachment, leading to inefficiencies and potential contamination risks during film deposition processes.
Innovation Solution
An automatic assembling device for semiconductor equipment, comprising a chamber lid, a ceiling, a suspension part, and a driving part with elevating and rotating units, which facilitates secure and efficient attachment and detachment of the ceiling to the chamber lid, reducing manual labor and preventing particle deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual assembly and unloading processes are used for semiconductor equipment ceilings, then operators can perform the tasks with simple equipment, but substantial manpower is required and the process is labor-intensive
Solution Approach 1:
The ceiling is designed with self-suspension capability through suspension parts that automatically engage with the chamber lid, eliminating the need for manual fastening operations while maintaining secure attachment during assembly and unloading processes
Solution Approach 2:
Suspension parts serve as intermediary components between the ceiling and chamber lid, providing automated connection and disconnection mechanisms that reduce manual labor while ensuring reliable attachment without requiring complex manual fastening equipment
2Device complexity
If only a center fastener is used to support the ceiling, then the structure is simple, but the ceiling may not be securely attached to the chamber lid
Solution Approach 1:
The attachment system is segmented into multiple suspension parts distributed across the ceiling structure, where each suspension part independently provides support and connection, collectively ensuring secure attachment without requiring a complex centralized fastening system
Solution Approach 2:
Multiple localized suspension points are distributed across the ceiling-chamber lid interface, with each suspension part providing localized support and connection, collectively ensuring uniform and secure attachment throughout the entire ceiling structure
3Reliability
If two operators are required to firmly attach the ceiling, then secure attachment can be achieved, but substantial manpower is demanded for loading or unloading
Solution Approach 1:
The suspension parts are designed to automatically engage and secure the ceiling to the chamber lid without requiring manual fastening operations, eliminating the need for multiple operators while maintaining firm attachment through self-activating mechanical engagement
Data Source
AI summary
The present invention is directed to an assembling device used for semiconductor equipment. The assembling device includes a chamber lid, a ceiling, a suspension part, a driving part and receptacles. The ceiling is disposed below the chamber lid. The suspension part is inserted through the chamber lid, and to be hooked to the ceiling. The driving part is disposed above the chamber lid and connected to the suspension part, and configured to drive the suspension part to join or separate the ceiling and the chamber lid. The receptacles are disposed in the ceiling and configured to be correspondingly attached to the suspension part, each of the receptacles defines a rotating groove that is open at top and closed at bottom.