Semiconductor Transfer Chamber Ionization for Particle and ESD Control
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Solution Overview
Problem
In semiconductor manufacturing, fine particles in the internal spaces of equipment pose a challenge due to their small size and irregular movement, making conventional methods ineffective for removal, and static electricity can lead to electrostatic discharge issues during substrate transfer.
Innovation Solution
A semiconductor substrate treatment system is designed with an ionizing device that emits ions of different polarities to charge particles, which are then collected by dust assemblies generating opposing electric fields, and a fan filter assembly with a dust collecting device to introduce laminar airflow for effective particle removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional particle removal methods are used, then the equipment structure remains simple, but fine particles cannot be effectively removed due to their small size and irregular movement
Solution Approach 1:
The patent changes the physical state and properties of particles by ionizing them, transforming neutral fine particles into charged particles that can be manipulated by electric fields. This parameter change (from neutral to charged) enables effective removal of particles that were previously difficult to control due to their small size and irregular movement
Solution Approach 2:
The patent replaces conventional mechanical particle removal methods with an electrostatic-based system. Instead of using mechanical filters or physical barriers that struggle with fine particles, the system uses ionizing devices and electric fields to charge and collect particles, achieving superior removal effectiveness without excessive mechanical complexity
2Productivity
If transfer devices are used to move substrates, then substrate transfer efficiency is improved, but electrostatic discharge issues occur due to static electricity generation
Solution Approach 1:
The patent converts the harmful static electricity generated during substrate transfer into a beneficial effect. By ionizing the transfer device surface and controlling charge distribution, the system uses electrostatic forces to prevent particle adhesion and reduce electrostatic discharge risks, transforming what was originally a harmful phenomenon into a protective mechanism
Solution Approach 2:
The patent introduces ions as an intermediary substance between the transfer device and particles. These ions act as a mediator that neutralizes static charges on the transfer device surface, preventing direct electrostatic discharge while maintaining efficient substrate transfer capability
3Manufacturing precision
If single-polarity ionizing devices are used, then the device structure is simple, but particles with different charges cannot be effectively collected
Solution Approach 1:
The patent segments the ionizing device into multiple regions with different polarities (positive and negative ion emission regions). This segmentation allows the system to generate and collect both positively and negatively charged particles simultaneously, achieving complete particle collection while maintaining a relatively simple overall device structure through modular regional design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces fine particles in the chamber by 68% and prevents electrostatic discharge by neutralizing static charges on transfer devices, ensuring cleaner semiconductor substrates.
Implementation Method 1
The ionizing device includes a first discharge device and a second discharge device on the second surface and configured to emit ions having a first polarity and a second polarity, respectively
Implementation Method 2
The first dust collecting assembly and the second dust collecting assembly are configured to collect the charged particles by generating electric fields having different polarities
Implementation Method 3
The third discharge device above the transfer device and configured to emit the ions having the first and second polarities together to neutralize a charge generated on a surface of the transfer device
Implementation Method 4
a fan filter assembly with a dust collecting device to introduce laminar airflow for effective particle removal
Data Source
AI summary
A semiconductor substrate treatment system includes: a chamber having an internal space defined by a first surface and a second surface of the chamber opposing each other, and a third surface of the chamber connected the first surface and the second surface; a transfer device in a central region of the internal space for transferring a semiconductor substrate; an ionizing device including first and second discharge devices on the second surface for emitting ions having a first polarity and a second polarity, respectively, to charge particles in the internal space with the first and second polarities, and a third discharge device disposed above the transfer device, and configured to emit ions having the first and second polarities together; and first and second dust collecting assemblies on the third surface, facing each other, and configured to collect charged particles by generating electric fields having different polarities.