Semiconductor Heat Spreader with Chamfered Edge and Laminated Insulation
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Solution Overview
Problem
Semiconductor devices with resin-sealed structures face challenges in achieving high insulation properties while maintaining effective heat dissipation, as thin insulating layers reduce insulation properties and using high-performance resins for thermal conductivity increases costs.
Innovation Solution
A semiconductor device with a laminated insulating sheet structure comprising an insulating layer and a metal layer, closely bonded to a heat spreader, and a chamfered portion at the outer peripheral end of the heat spreader to distribute electric fields and improve insulation, combined with a molding resin that seals the device except for the back surface of the metal layer, allowing for excellent heat dissipation and insulation properties at a lower cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the insulating layer thickness is reduced to improve heat dissipation characteristics, then heat dissipation performance is improved, but insulation properties deteriorate
Solution Approach 1:
The patent uses a laminated structure combining an insulating layer and a metal layer (foil) to create a composite insulating sheet. The metal layer provides additional insulation capability, allowing the overall insulating layer to be thinner while maintaining sufficient insulation properties. This composite structure enables both thin thickness for heat dissipation and adequate insulation for reliability.
Solution Approach 2:
The patent applies different materials and thicknesses at different locations. The insulating layer is positioned directly under the heat spreader where heat dissipation is critical, while the metal layer provides additional insulation in regions where electrical field concentration occurs. This local differentiation allows optimization of both heat dissipation and insulation properties in different areas.
2Loss of energy
If a resin with excellent thermal conductivity is used for the insulating layer to improve heat dissipation characteristics, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
Instead of using an expensive high-thermal-conductivity resin throughout the entire insulating layer, the patent uses a conventional resin combined with a metal layer (foil). The metal layer provides the necessary thermal conduction path, allowing the use of cheaper resin material while maintaining effective heat dissipation performance, thus reducing overall manufacturing cost.
Solution Approach 2:
The metal layer acts as an intermediary thermal conduction path between the heat spreader and the molding resin. It provides an efficient heat conduction route without requiring the entire insulating layer to be made of expensive high-thermal-conductivity material, thereby reducing costs while maintaining heat dissipation effectiveness.
3Loss of energy
If the insulating layer is made thin to improve heat dissipation, then heat dissipation characteristics are improved, but the resin cannot sufficiently enter the region, causing extreme decline in mold characteristics
Solution Approach 1:
The laminated structure of insulating layer and metal layer creates a composite sheet with appropriate thickness and structural integrity. This composite structure allows the resin to sufficiently enter and fill the space during molding while maintaining the necessary insulation thickness, thus preserving mold characteristics and filling properties.
Solution Approach 2:
By changing the structure from a single thick insulating layer to a laminated composite structure, the patent modifies the physical parameters of the insulating sheet. The laminated structure provides adequate thickness for resin filling while maintaining effective insulation, thus resolving the conflict between thin thickness for heat dissipation and sufficient thickness for mold filling.
4Loss of energy
If a laminated structure of insulating layer and metal layer is used to improve heat dissipation and insulation, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The patent uses a laminated structure of insulating layer and metal layer to achieve both good insulation and heat dissipation properties. This composite structure provides enhanced thermal performance by combining materials with complementary properties, allowing the insulating sheet to function as both an electrical insulator and a thermal management component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances insulation properties by distributing electric fields and reducing voids, achieving high heat dissipation and reliability while minimizing costs by using a cost-effective resin-sealed structure.
Implementation Method 1
an insulating layer having a thermal conductivity higher than that of the molding resin
Implementation Method 2
The heat spreader has a chamfered portion obtained by R chamfering or C chamfering at an outer peripheral end portion of the back surface thereof
Implementation Method 3
The molding resin seals the semiconductor element, the heat spreader, and the insulating sheet portion except for a back surface of the metal layer
Data Source
AI summary
In the present invention, a heat spreader has a sagging surface or a C surface being a chamfered portion at an outer peripheral end portion of a back surface thereof. A plurality of power elements formed into chips are mounted on a surface of the heat spreader with a solder therebetween, and an insulating sheet portion is located on the back surface side of the heat spreader. The insulating sheet portion has a laminated structure of an insulating layer and a metal foil, and the insulating layer being the upper layer is closely bonded to the back surface of the heat spreader. A space region between the sagging surface and the insulating sheet portion is filled with a molding resin.