3D Stacked Semiconductor Chip Arrangement with Sensor and ASIC
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Solution Overview
Problem
Existing semiconductor sensor chip arrangements, including pressure and temperature sensors, are excessively large due to complex mounting and housing requirements, necessitating a miniaturized and thermomechanically stable configuration for various applications.
Innovation Solution
A semiconductor chip arrangement where an ASIC chip with an integrated circuit is mounted on a carrier using an adhesion layer, with a sensor chip electrically connected to the ASIC chip via interchip connections like solder balls, and embedded in a molding compound, allowing for mechanical decoupling and thermomechanical stability, along with a covering layer for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensor chips are mounted in traditional housings with die bonding and bonding wires, then reliable electrical connections are achieved, but the arrangement occupies excessively large volume
Solution Approach 1:
The patent combines the sensor chip and ASIC chip into a single integrated arrangement mounted directly on a circuit board carrier, eliminating the need for separate traditional housings. The sensor chip is positioned in direct proximity to the ASIC chip with interchip connections formed between them, merging multiple components into a compact unified structure that significantly reduces overall volume while maintaining electrical connection reliability.
Solution Approach 2:
The patent transitions from planar mounting to three-dimensional stacking by positioning the sensor chip above the circuit board carrier in the vertical dimension, with the ASIC chip also mounted on the carrier. This vertical arrangement in the Z-direction allows multiple chips to occupy overlapping footprint areas, dramatically reducing the horizontal area and overall volume of the sensor arrangement while preserving all necessary electrical connections.
2Stability of the object's composition
If chips are mounted in traditional housings, then mechanical stability is achieved, but the arrangement becomes excessively large
Solution Approach 1:
The patent merges the housing function into the circuit board carrier itself, which provides mechanical support and stability for both the ASIC chip and sensor chip. The carrier acts as a common mounting substrate that mechanically stabilizes the entire arrangement while eliminating the need for additional housing structures, thereby achieving mechanical stability in a compact form factor.
Solution Approach 2:
The circuit board carrier performs multiple functions simultaneously: it provides mechanical support and stability for the chips, serves as the mounting substrate for both the ASIC and sensor chips, provides electrical connections through its conductor tracks and contact pads, and acts as the structural foundation for the entire sensor arrangement. This multi-functionality eliminates the need for separate housing components, reducing volume while maintaining mechanical stability.
3Reliability
If complex mounting methods like die bonding and bonding wires are used, then reliable electrical connections are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the traditional housing and its associated complex mounting processes from the sensor arrangement. By mounting the chips directly on the circuit board carrier without separate housings, the manufacturing process is simplified while maintaining reliable electrical connections through direct bonding and interchip connections.
Solution Approach 2:
The patent employs preliminary preparation of the circuit board carrier with pre-formed conductor tracks, contact pads, and mounting structures before chip attachment. The ASIC chip and sensor chip are prepared with their respective connection structures in advance, allowing for streamlined assembly processes that reduce manufacturing complexity while ensuring reliable electrical connections are achieved during the mounting process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact, flexible, and thermomechanically stable miniaturized sensor arrangement that can be adapted for different applications, providing protection against environmental influences and mechanical stresses while allowing for efficient integration of multiple sensors.
Implementation Method 1
A suitable adhesion layer is provided for fixing
Implementation Method 2
in particular, solder balls (solder bumps) can be provided
Implementation Method 3
the semiconductor chip arrangement can be embedded into a molding compound
Implementation Method 4
a covering layer for protection
Data Source
AI summary
On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.