Semiconductor Device Built-In Chip Capacitor Coupling Failure Detection
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Solution Overview
Problem
The existing semiconductor device structure with a built-in chip capacitor faces challenges in detecting coupling failures, particularly due to the presence of multiple chip capacitors in parallel, which complicates the detection of disconnection and affects the reliability of the semiconductor device.
Innovation Solution
The semiconductor device incorporates a modified structure with additional terminals and conduction paths on both surfaces of the wiring substrate, allowing for separate coupling tests of each chip capacitor electrode, ensuring reliable detection of disconnections and improving the overall reliability of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple chip capacitors are coupled in parallel to achieve sufficient total capacitance, then the required capacitance value is met, but it becomes difficult to detect coupling failures in individual capacitors
Solution Approach 1:
The patent divides the detection function by providing separate detection terminals for each chip capacitor. Instead of treating multiple capacitors as a single parallel unit, the invention segments the measurement paths so that each capacitor can be individually tested for coupling failures while still contributing to the total capacitance requirement.
Solution Approach 2:
The patent introduces intermediate detection terminals that act as mediators between the chip capacitors and the measurement system. These terminals enable indirect observation of each capacitor's coupling status without disrupting the parallel configuration needed for achieving the required total capacitance.
2Reliability
If a continuity test is conducted to check coupling between wiring layers, then connectivity is verified, but coupling failures in chip capacitors cannot be detected due to alternative conduction paths
Solution Approach 1:
The patent extracts the detection function from the general continuity test by providing dedicated detection terminals specifically for testing chip capacitor coupling. This separation allows the detection system to focus exclusively on capacitor coupling status without being influenced by alternative conduction paths through other components.
Solution Approach 2:
The patent performs preliminary detection by providing terminals that enable testing of chip capacitor coupling before final assembly and before alternative conduction paths are activated. This preliminary measurement capability allows detection of coupling failures in the capacitor assembly itself independent of other circuit paths.
3Measurement precision
If capacitance measurement is used to detect coupling failures, then individual capacitor status can be assessed, but the variation in total capacitance value among multiple capacitors masks individual failures
Solution Approach 1:
The patent segments the measurement function by providing separate detection terminals for each chip capacitor. This segmentation enables individual capacitance measurement of each capacitor without being affected by the parallel combination effect, where the total capacitance variation masks individual failures.
Solution Approach 2:
The patent applies partial measurement by providing detection terminals for specific capacitors that need monitoring, rather than requiring measurement of all capacitors in the system. This selective measurement approach achieves sufficient detection capability without the complexity of comprehensive measurement of all components.
Data Source
AI summary
A semiconductor device which provides improved reliability. The semiconductor device includes: a wiring substrate having a first surface and a second surface opposite to the first surface; a chip condenser built in the wiring substrate, having a first electrode and a second electrode; a first terminal and a second terminal disposed on the first surface; and a third terminal disposed on the second surface. The semiconductor device further includes: a first conduction path for coupling the first terminal and the third terminal; a second conduction path for coupling the first terminal and the first electrode; a third conduction path for coupling the third terminal and the first electrode; and a fourth conduction path for coupling the second terminal and the first electrode.